A kind of semiconductor diode production process

Abstract

The invention belongs to the technical field of production of semiconductor diodes, and particularly relates to a semiconductor diode production technology. The semiconductor diode production technology adopts a glue sealing device. The glue sealing device comprises a bottom plate, vertical columns, a top plate, a glue sealing groove, drying modules, a storing block and storing holes. A set of telescopic rods is arranged at the bottom of the top plate. The storing block is arranged at the ends of the telescopic rods. The set of storing holes is formed in the bottom of the storing block. Each drying module comprises an arc-shaped sliding groove, an electric heating pipe, a swinging gear and a swinging plate. Each arc-shaped sliding groove is formed in the middle of the corresponding vertical column. Each electric heating pipe is slidably mounted in the corresponding arc-shaped sliding groove. A spring connected with the corresponding electric heating pipe is arranged at one end of eacharc-shaped sliding groove. Each swinging gear is rotationally mounted at the two ends of the corresponding electric heating pipe through torsional springs. A swinging plate rotationally mounted on thecorresponding vertical column is arranged on each arc-shaped sliding groove. A tooth groove meshing with the corresponding swinging gear is formed in the end of each swinging plate. The swinging plates are controlled to rotate through a motor. According to the semiconductor diode production technology, leads subjected to glue sealing can be dried uniformly, and by arranging a clamping device, thesemiconductor diode production technology can adapt to glue sealing of the leads of different thicknesses.

Description

technical field [0001] The invention belongs to the technical field of semiconductor diode production, in particular to a semiconductor diode production process. Background technique [0002] The leads of the diode need to be sealed with glue so that they can be prepared into a complete diode. In the existing sealing process, the lead wires are often repeatedly contacted between multiple sealing teeth on the sealing rack, so that the glue liquid above the sealing teeth realizes gluing treatment on the leads. However, in the above-mentioned sealing process, the lead wire will also rub against the sealing teeth while applying the glue, so that the lead wire may be bent; at the same time, it is difficult to ensure the uniformity of the glue distribution on the sealing teeth , It is also difficult to control the gluing uniformity of the lead. [0003] There are also some technical solutions for sealing diode leads in the prior art. For example, a Chinese patent with applicatio...

AI Technical Summary

Problems solved by technology

[0004] This process is used to seal the leads of the secondary tube. After the seal is completed, the heating tube is only installed on one side when the glue is dried, which makes the drying efficiency low. At the same time, this process cannot be applied to leads of different thicknesses. Sealant, making it less versatile

Images