Multifunctional monitoring system for laser machining, monitoring method and directing method
A laser processing and monitoring system technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of slow data processing speed, high integration difficulty, large volume, etc., and achieve low cost, high imaging performance, and volume. small effect
Pending Publication Date: 2018-11-06
XIAN MICROMACH TECH CO LTD
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Problems solved by technology
[0005] The purpose of the present invention is to solve the technical problems of the existing laser processing monitoring device such as slow data processing speed, high cost, large volume and high integration difficulty, and provide a multifunctional monitoring system, monitoring method and pointing method for laser processing, which can realize the Versatile monitoring for measurement of process parameters such as laser power, energy distribution and beam pointing
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[0046] Below in conjunction with accompanying drawing and specific embodiment the content of the present invention is described in further detail:
[0047] Such as figure 1 Shown is the multifunctional monitoring system for laser processing provided by the present invention. The system has the function of monitoring process parameters such as laser power, energy distribution and beam pointing. The system includes a spectroscopic module 1, a monitoring lens 2, an optical filter 3, Baffle 4 , imaging component 5 , motion module 6 and signal processing module 7 .
[0048]The beam splitting module 1 is installed in the optical path of laser processing. The laser beam is divided into two beams by the beam splitting module 1, one of which is turned 90° by the beam splitting module 1 and enters the monitoring lens 2, and the other passes through the beam splitting module 1 and enters the processing head to realize laser processing , The spectroscopic module 1 is equipped with a spec...
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Abstract
The invention relates to a multifunctional monitoring system for laser machining, a monitoring method and a directing method. The problems that an existing laser machining mode is low in data processing speed, high in cost, large in size and high in integration difficulty are solved. The system comprises a light splitting module, a monitoring lens, an imaging assembly, a movement module and a signal processing module; the light splitting module is installed in a laser machining light path; a laser beam is divided into two paths through the light splitting module; one path of the laser beam isreplicated by 90 degrees by the light splitting module to enter the monitoring lens; the other path of the laser beam penetrates through the light splitting module to achieve the laser machining; themonitoring lens and the imaging assembly are arranged on a reflecting light path of the light splitting module; the movement module achieves movement of the imaging assembly; the monitoring lens comprises an optical system; the imaging assembly comprises a detector and an imaging circuit board; and the signal processing module is connected with the detector. Meanwhile, the invention further provides a monitoring method based on the system and a position directing method for achieving the machining laser.
Description
technical field [0001] The invention relates to the technical field of laser processing, in particular to the field of laser processing which has high requirements on laser power, energy distribution and beam pointing, and specifically relates to a multifunctional monitoring system, monitoring method and pointing method for laser processing. Background technique [0002] Laser processing has the characteristics of high processing precision, good quality, and flexibility, so it has been widely used in industrial fields such as steel, machinery, automobiles, and semiconductors. For laser processing equipment, its reliability depends on the stability of the laser processing optical path. The laser processing process is the result of the interaction between the laser and the material. The processing quality is affected by the process parameters such as laser power, energy distribution and beam pointing. Only by achieving effective process parameters can the best processing quali...
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IPC IPC(8): B23K26/067B23K26/70B23K26/00
CPCB23K26/00B23K26/067B23K26/70B23K26/702
Inventor 张凯胜杨小君赵华龙康伟朱文宇
Owner XIAN MICROMACH TECH CO LTD