Diode lead sealing treatment process

A processing technology and diode technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of difficult to control the uniformity of lead glue, difficult to ensure the uniformity of distribution, and difficult to meet market demand, etc. The effect of convenient loading and unloading, improving yield and reducing labor costs

Active Publication Date: 2018-11-06
阳信鑫隆电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in the above-mentioned sealing process, the lead wire will also rub against the sealing teeth while applying the glue, so that the lead wire may be bent; at the same time, because the glue distribution on the sealing teeth is difficult to ensure, It is also difficult to control the gluing uniformity of the lead
Moreover, the traditional sealing process has low production efficiency and is difficult to meet market demand

Method used

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  • Diode lead sealing treatment process
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  • Diode lead sealing treatment process

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Embodiment Construction

[0029] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0030] Such as Figure 1 to Figure 5 As shown in the present invention, a diode lead wire sealing treatment process, the method adopts the following gluing device, the gluing device includes a fixed bracket 1, a feeding device 2, a gluing device 3, a liquid guide tube 4, a gas Guide pipe 5, drying device 6, circulation device 7 and negative pressure pump 9; the feeding device 2 is located inside the fixed bracket 1, and the feeding device 2 is used for the input and output of diodes; the gluing device 3 is located in On the right side of the fixed bracket 1, the gluing device 3 is used to apply glue to the diode lead; The other end is fixed below the fixed bracket 1, and the liquid guide tube 4 is provided with a glue injection port 8, which is u...

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Abstract

The invention relates to the technical field of microelectronic components, in particular to a diode lead sealing treatment process, comprising a fixing bracket, a feeding device, a gluing device, a liquid guiding tube, a gas guiding tube, a drying device, a circulation device and a negative pressure pumping device, wherein the feeding device is located inside the fixing bracket, the feeding device is used for conveying the diode; the gluing device is located on the right side of the fixing bracket, the gluing device is used for gluing the diode lead; the liquid guiding tube is fixed on the right side of the fixing bracket, the liquid guiding tube is provided with a glue injection port; the gas guiding tube is located at the right side of the liquid guiding tube; the drying device is located at the bottom of the fixing bracket, and used for drying the glued diode Lead; the circulation device is located in the middle of the liquid guiding tube; and the negative pressure pumping device is located on the gas guiding tube. The device is suitable for sizing of a large number of diode leads, which is beneficial to improve productivity.

Description

technical field [0001] The invention relates to the technical field of microelectronic components, in particular to a diode lead wire sealing glue treatment process. Background technique [0002] The leads of the diode need to be sealed with glue so that they can be prepared as a complete diode. In the existing sealing process, the lead wires are repeatedly contacted between multiple sealing teeth on the sealing rack, so that the glue liquid above the sealing teeth realizes gluing treatment on the leads. However, in the above-mentioned sealing process, the lead wire will also rub against the sealing teeth while applying the glue, so that the lead wire may be bent; at the same time, because the glue distribution on the sealing teeth is difficult to ensure, It is also difficult to control the gluing uniformity of the leads. Moreover, the production efficiency of the traditional sealing process is low, and it is difficult to meet the market demand. [0003] In view of this, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56H01L21/48
CPCH01L21/4885H01L21/56
Inventor 汤美侠范昕
Owner 阳信鑫隆电子有限公司
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