Baking device, system and method thereof for verifying wafer aging

A technology for baking devices and wafers, used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as test failures, personnel burns, oven temperature, and wind speed changes that cannot be automatically acquired and stored, so as to improve production. Manufacturing process, high degree of automation, and the effect of improving test quality

Inactive Publication Date: 2018-11-06
江苏澳芯微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are many defects in the existing industrial ovens for wafer baking: for example, the batch of wafers during wafer baking, the number of the oven used, the temperature in the oven during the wafer test process, and changes in wind speed cannot be automatically obtained and analyzed. Storage is not conducive to tracing the baking process; wafer baking parameters need to be manually input and set, which is prone to errors, resulting in test failure; after the wafer baking is completed, manual detection of defective products is required; manual opening and closing of the oven door may cause errors Open the oven, resulting in test failure, personnel burns, scalds and other accidents

Method used

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  • Baking device, system and method thereof for verifying wafer aging
  • Baking device, system and method thereof for verifying wafer aging
  • Baking device, system and method thereof for verifying wafer aging

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Embodiment Construction

[0031] Preferred embodiments of the present invention are described below with reference to the accompanying drawings.

[0032] like figure 1 and figure 2 As shown, a baking device for verifying wafer aging includes an oven 1, the oven 1 includes a heater 11, an electronic lock 12, a fan 13, a wind speed sensor 14, a temperature sensor 15 and a controller 16, the heater 11, an electronic lock 12. The fan 13, the wind speed sensor 14 and the temperature sensor 15 are electrically connected to the controller 16.

[0033] There are four wind speed sensors 14 and four temperature sensors 15 respectively, and the wind speed sensors 14 and the temperature sensors 15 are respectively arranged at four corners of the inner wall of the oven 1 .

[0034] Concrete, also comprise network camera 17 and alarm 18, network camera 17 is arranged on the oven 1 inner wall top center below, alarm 18 is arranged on oven 1 outer wall top, network camera 17 and alarm 18 are connected with controll...

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PUM

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Abstract

The invention provides a baking device, system and method thereof for verifying wafer aging. The baking device comprises an oven, wherein the oven comprises a heater, an electronic lock, a fan, a windspeed sensor, a temperature sensor and a controller; and the heater, the electronic lock, the fan, the wind speed sensor and the temperature sensor are electrically connected with the controller. Thebaking device, system and method thereof for verifying wafer aging in the invention can monitor the temperature, wind speed and the change of the wafer itself in the baking process of the wafer in real time, facilitates the supervision and traceability of the wafer testing process, and has high automation of information entry, thereby reducing errors in manual information entry and improving testefficiency and test quality.

Description

technical field [0001] The invention belongs to the technical field of wafer testing, and in particular relates to a baking device, system and method for verifying wafer aging. Background technique [0002] During the manufacturing process of semiconductor wafers, wafers usually need to be placed in an oven for baking. One is to dry the ink print after the wafer is printed with ink, and the other is for high-temperature performance testing, that is, to test whether the wafer product functions normally under a specific high-temperature state. During the baking process of wafers, precise control of temperature and time is required. After baking, it is necessary to carefully check and remove defective wafers. However, there are many defects in the existing industrial ovens for wafer baking: for example, the batch of wafers during wafer baking, the number of the oven used, the temperature in the oven during the wafer test process, and changes in wind speed cannot be automatical...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67098H01L21/67248H01L21/67253H01L21/67288
Inventor 王印玺秦超陶源
Owner 江苏澳芯微电子有限公司
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