A cooling device suitable for mos tubes
A technology of MOS tubes and heat sinks, applied in the field of MOS tube heat sinks, can solve the problems of low heat dissipation efficiency of MOS tubes, and achieve the effects of low heat dissipation efficiency, accelerated heat dissipation efficiency, and simple structure
Active Publication Date: 2020-02-21
ANHUI JIETAI INTELLIGENT TECH
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- Application Information
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Problems solved by technology
[0004] The purpose of the present invention is to solve the shortcoming of the low heat dissipation efficiency of the MOS tube in the prior art, and propose a heat dissipation device suitable for the MOS tube
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[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.
[0024] refer to Figure 1-5 , a heat dissipation device suitable for MOS tubes, including a fixed shell 2 and a heat sink 4, the fixed shell 2 is composed of two L-shaped brackets, the L-shaped brackets can accurately limit and fix the MOS tube 1, and the two L-shaped brackets There is a MOS tube 1 in the cavity formed by the shaped bracket, and a heat sink 3 is fixedly connected inside the fixed shell 2. The heat sink 3 is close to the back side wall of the MOS tube 1, and the heat sink 3 is close to the back side wall of the MOS tube 1, which can be faster. The heat on the rear side wall of the MOS tube 1 is conducted, so as to be conducted to the heat dissipation ...
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The invention discloses a cooling device applicable for an MOS tube. The cooling device comprises a fixed shell and a cooling box, wherein the fixed shell consists of two L-shaped supports; an accommodating cavity formed by the two L-shaped support is internally provided with the MOS tube; the interior of the fixed shell is fixedly connected with cooling fins; the cooling fins cling to the rear side wall of the MOS tube; the rear end face of the fixed shell is connected with the cooling box in a penetrated manner; the interior of the cooling box is fixedly connected with a partition plate; a plurality of cooling liquid cavities are formed in the partition plate in an equally-spaced manner; a cooling liquid is placed inside the cooling liquid cavities; the rear end face of the partition plate is fixedly connected with a plurality of cooling fans; and a plurality of through holes are formed in the rear side wall of the cooling box. According to the cooling device, efficient cooling for the MOS tube can be reached through the simple structure, and the disadvantage that the MOS tube is low in cooling efficiency in the working process in the prior art is solved preferably.
Description
technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device suitable for MOS tubes. Background technique [0002] MOSFET (MetalOxideSemiconductorFieldEffectTransistor), that is, a metal oxide semiconductor field effect transistor, belongs to the insulated gate type of field effect transistors. Therefore, MOS tubes are sometimes called field effect tubes. In general electronic circuits, MOS tubes are usually used in amplifying circuits or switching circuits. In the power supply voltage stabilizing circuit on the main board, the role of the MOSFET is mainly to judge the potential, which is often represented by "Q" plus a number on the main board. [0003] MOS tubes are often used in inverter power supplies, solar controllers, discharge instruments, UPS power supplies and other products, especially high-power power supply products need to use MOS tubes, and MOS tubes are a power device, and the temperature is very high...
Claims
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IPC IPC(8): H01L23/367H01L23/467
CPCH01L23/367H01L23/3672H01L23/467
Inventor 陈迎宾汪加泰吕毓鑫
Owner ANHUI JIETAI INTELLIGENT TECH