Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Printing machine for penetrating hole with silver paste of PCB

A technology for PCB boards and printing machines, which is applied in the field of printing machines for silver paste through-holes on PCB boards, to achieve the effect of reducing pollution

Active Publication Date: 2018-11-06
HANGZHOU LINAN PENGYU ELECTRONICS
View PDF5 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies in the prior art, the object of the present invention is to provide a printing machine for silver paste through-holes on PCB boards, which has the advantage of reducing backing plate pollution.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printing machine for penetrating hole with silver paste of PCB
  • Printing machine for penetrating hole with silver paste of PCB
  • Printing machine for penetrating hole with silver paste of PCB

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037]The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0038] A printing machine for through-hole silver paste on PCB board, such as figure 1 and figure 2 As shown, it includes a workbench 1, an elevator frame arranged on the workbench 1, a screen installed on the elevator frame and a controller 2 for controlling the lifting of the elevator frame (combined with Figure 4 ), the workbench 1 below the screen is provided with a backing plate 3 for placing circuit boards, the workbench 1 is provided with a cleaning brush 4 for cleaning the backing plate 3, and the workbench 1 is provided with a driving cleaning brush 4 along the surface of the backing plate 3 The driving device for reciprocating cleaning is electrically connected to the controller 2 for controlling the operation of the driving device, and the lifting frame and the driving device work asynchronously. The backing plate 3 is cleaned by the cle...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of circuit board printing, in particular relates to a printing machine for penetrating a hole with silver paste of a PCB. The printing machine comprises aworkbench, a lifting rack, a mesh plate and a controller, wherein the lifting rack is arranged on the workbench, the mesh plate is arranged on the lifting rack, the controller is used for controllingthe lifting rack to ascend and descend, a cushion plate is arranged on the workbench arranged below the mesh plate and is used for placing a circuit board, a cleaning brush is arranged on the workbench and is used for cleaning the cushion plate, a driving device is arranged on the workbench and is used for driving the cleaning brush to move and clean along a surface of the cushion plate in a reciprocating way, the driving device is electrically connected with the controller, the controller is used for controlling the driving device to work, and the lifting rack and the driving device asynchronously work. The printing machine for penetrating the hole with the silver paste of the PCB has the advantage that the pollution of the cushion plate is reduced.

Description

technical field [0001] The invention relates to the technical field of circuit board printing, more specifically, it relates to a printing machine for through-hole silver paste on a PCB board. Background technique [0002] Silver paste through-hole printing is a new technology for making double-sided panels. It uses a physical method to connect through the conductive lines on both sides. Its production technology is to use silver conductive paste to penetrate into the prefabricated holes through the missing printing of the screen screen, and then use the capillary principle to penetrate the silver paste into the through holes of the circuit board, so that the through holes are filled. Silver conductive ink to form interconnection conduction. [0003] The silver paste through-hole printing commonly used in the industry currently uses the screen, scraper, and backing plate in the printing machine to fix the backing plate on the printing machine table for placing circuit boar...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/42
CPCH05K3/42
Inventor 朱晓东王云飞徐剑付水泉
Owner HANGZHOU LINAN PENGYU ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products