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Heat dissipation component and electronic device

A technology for heat dissipation components and electronic devices, applied in circuit thermal devices, circuits, electrical components, etc., can solve the problems of chip power consumption and electronic equipment temperature rise, avoid local overheating, improve grip feel, and improve user experience. Effect

Active Publication Date: 2018-11-06
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The development of chips not only brings about the problem of power consumption, but also due to the thinning and thinning of electronic devices, the heat of chips is sealed inside the electronic equipment, which makes the temperature of electronic equipment rise.

Method used

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  • Heat dissipation component and electronic device

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Embodiment Construction

[0016] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It should be understood that the specific embodiments described here are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, for the convenience of description, only some structures related to the present application are shown in the drawings but not all structures. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

[0017] The terms "first", "second", etc. in this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "include" and "have", as well as any variations thereof, are intended to cover a non-e...

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Abstract

The present application discloses a heat dissipation component and an electronic device. The heat dissipation component comprises a middle frame, a circuit board, a heat source chip and a heat tube, wherein the middle frame comprises a first region and a second region, which are opposite to each other; the circuit board is arranged to the first region; the heat source chip is arranged on the circuit board and located between the circuit board and the middle frame; the heat tube is arranged in the middle frame and comprises a first section and a second section; the end portion of the first section is connected with the heat source chip and stretches to the side wall of the middle frame; and the second section is attached to the side wall of the middle frame and stretches to the second region. Through the aforementioned manner, the electronic device can be avoided from local overheating to result in damage of components; besides, the heat is dispersed which facilitates to improve the holding feeling of the electronic device and improve the user experience.

Description

technical field [0001] The present application relates to the technical field of mobile terminals, in particular to a heat dissipation component and an electronic device. Background technique [0002] The interior of an electronic device generally includes a control chip (ie, a core processor). With the diversification and intelligence of its functions, the requirements for the chip are also very high. The main frequency of current chips is generally 1GHz, 2GHz or even higher, and dual-core, quad-core and even eight-core chips are very common. [0003] The development of chips not only brings about the problem of power consumption, but also due to the thinning and thinning of electronic devices, the heat of chips is sealed inside the electronic equipment, which makes the temperature of electronic equipment rise. Contents of the invention [0004] A technical solution adopted in the present application is to provide a heat dissipation assembly, which includes: a middle fra...

Claims

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Application Information

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IPC IPC(8): H05K7/20H05K1/02H01L23/427H01L23/367
CPCH01L23/367H01L23/427H05K1/0203H05K7/20336
Inventor 田汉卿
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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