Multipiece wiring board, wiring board, and method for manufacturing multipiece wiring board

Abstract

A multipiece wiring board is provided with a motherboard which includes a first main surface and a second main surface opposing the first main surface, and on which a plurality of wiring board regionsare arranged. The motherboard includes dividing grooves disposed on the first main surface and the second main surface along the boundaries of the wiring board regions. The dividing grooves include:a first dividing groove disposed along one side of the wiring board regions on the first main surface; a second dividing groove disposed on the second main surface so as to oppose the first dividing groove; a third dividing groove disposed along another side of the wiring board regions on the first main surface; and a fourth dividing groove disposed on the second main surface so as to oppose the third dividing groove. The depth of the first dividing groove and the depth of the second dividing groove are greater than the depth of the third dividing groove and the depth of the fourth dividing groove. The multipiece wiring board includes a first curved portion in which the depth of the third dividing groove is gradually increased, and a second curved portion in which the depth of the fourth dividing groove is gradually increased, toward a corner of the wiring board regions.

Description

technical field [0001] The present invention relates to a multi-piece wiring board, a wiring board, and a method for manufacturing a multi-piece wiring board in which a plurality of wiring board regions having electronic component mounting portions are arranged vertically and horizontally on a mother board. Background technique [0002] Conventionally, there is known a multi-piece wiring board in which a plurality of wiring board regions are arranged vertically and horizontally on a mother board. Separation grooves are formed on the main surface such as the upper surface of the mother substrate along the boundary of the wiring board region. The mother substrate is broken by applying bending stress to the mother substrate across the division groove, and is divided into individual wiring substrates. The division grooves are formed, for example, by using a dicing blade or the like to make notches at a predetermined depth on the upper surface and the lower surface of the unfire...

AI Technical Summary

Problems solved by technology

That is, by forming through-holes for the positional deviation of the dividing grooves in the upper and lower surfaces, it is possible to make a multi-piece wiring board that is not easily affected by the positional deviation of the dividing grooves. In the case of a wiring board on which through holes are formed, in the processing of the dividing grooves by laser, the width of the dividing grooves i

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