31results about How to "Suppress glitch" patented technology

The present invention provides pressure-sensitive adhesive films with a favourable visual appearance and surface printability without discoloration and burrs on the cutting edge after short-wavelength laser machining. At the same time, the PSA films of the present invention exhibit a favourable cuttability, allowing for high fiber laser as well as carbon dioxide laser cutting speeds. Since the use of the PSA films of the present invention as surface protecting films does not require extensive cleaning and polishing operations after the cutting process and the cutting process itself may be accelerated, the efficiency of laser machining methods may be improved.

The invention provides a drilling method for a carbon grid assembly of an iron propeller, belongs to the field of iron propeller manufacturing, and relates to a mechanical processing method of pairs of drill holes of the carbon grid assembly under one-time clamping by utilizing a mode for cooling drill holes through a step drill and external sprayed high-pressure liquid nitrogen. The method comprises the steps that firstly, the spherical-crown-shaped carbon grid assembly is clamped on a machine table in a 'sandwich' mode, the step drill is used for different diameters of small holes in pairs of the carbon grid assembly at a time, and the high-pressure liquid nitrogen is used for cooling processing to reduce the cutting temperature; then, drilling of other carbon grid array holes is completed under the control of a numerical control system. The method effectively reduces burrs and lamination defects which are caused by drilling by adding upper and lower supporting plates of the carbon grid assembly, the liquid nitrogen is used for cooling processing to greatly reduce the temperature of a cutting area, and oxidation, ablation and other defects of the carbon grid assembly are effectively restrained; the position precision of the array holes of the carbon grid assembly is ensured by using the step drill to process the holes in pairs at a time, the processing efficiency is high, andthe precision uniformity is good.

The multi-piece wiring substrate includes: a mother substrate having a first main surface and a second main surface opposite to the first main surface, and a plurality of wiring substrate regions are arranged, the mother substrate includes: a division groove along the wiring substrate region The boundary of the boundary is set on the first main surface and the second main surface, and the dividing groove has: the first dividing groove, which is arranged on the first main surface of one side of the wiring substrate region; the second dividing groove, which is opposite to the first dividing groove Provided on the second main surface; the third dividing groove is provided on the first main surface of the other side of the wiring substrate region; and the fourth dividing groove is provided on the second main surface opposite to the third dividing groove, and the first The depth of the division groove and the depth of the second division groove are set larger than the depth of the third division groove and the depth of the fourth division groove, and the depth of the third division groove is gradually increased toward the corner of the wiring board region. a curved portion, and has a second curved portion in which the depth of the fourth dividing groove gradually increases toward the corner of the wiring substrate region.

The invention discloses a milling and drilling combined machining cutter. The milling and drilling combined machining cutter comprises a cutter body and a cutter handle; the cutter body comprises a drilling part, a milling part and a guide part which are arranged in sequence; the guide part is connected with the cutter handle; the drilling part is positioned at the front end of the milling part; the milling part has certain conicity; the guide part comprises at least two long helical chip discharging grooves which extend from the drilling part to the cutter handle; a part, positioned between two adjacent long helical chip discharging grooves, of the cutter body forms a blade petal; the side surface, close to the long helical chip discharging grooves and opposite to the rotating direction of the cutter body, of the blade petal is provided with a cylindrical guide blade strip; the side surface, opposite to the rotating direction of the cutter body, of each long helical chip discharging groove is intersected with the milling part to form a taper long milling blade; the blade petal is provided with at least one short helical chip discharging groove which extends from the milling part to the guide part; and the milling part is intersected with the side surface, opposite to the rotating direction of the cutter body, of each short helical chip discharging groove to form a taper short milling blade. Under a composite material drilling machining condition, the milling and drilling combined machining cutter disclosed by the invention can reduce an axial cutting force so as to prevent defects of layering, cracks and burrs generated at the outlet of a machined hole.