Multi-chip wiring substrate, wiring substrate

Abstract

The multi-piece wiring substrate includes: a mother substrate having a first main surface and a second main surface opposite to the first main surface, and a plurality of wiring substrate regions are arranged, the mother substrate includes: a division groove along the wiring substrate region The boundary of the boundary is set on the first main surface and the second main surface, and the dividing groove has: the first dividing groove, which is arranged on the first main surface of one side of the wiring substrate region; the second dividing groove, which is opposite to the first dividing groove Provided on the second main surface; the third dividing groove is provided on the first main surface of the other side of the wiring substrate region; and the fourth dividing groove is provided on the second main surface opposite to the third dividing groove, and the first The depth of the division groove and the depth of the second division groove are set larger than the depth of the third division groove and the depth of the fourth division groove, and the depth of the third division groove is gradually increased toward the corner of the wiring board region. a curved portion, and has a second curved portion in which the depth of the fourth dividing groove gradually increases toward the corner of the wiring substrate region.

Description

Technical field [0001] The present invention relates to a multi-link substrate, a wiring substrate, a wiring substrate, a wiring substrate, and a multi-linking substrate, a plurality of wiring substrates, a plurality of wiring substrates, a plurality of wiring substrate regions having a mounting portion having an electronic component as a longitudinally arranged. Background technique [0002] Incidentally, a multi-connective wiring substrate having a plurality of wiring substrate regions is known as the mother substrate is known. The split groove is formed in the main surface of the mother substrate or the like along the boundary of the wiring substrate region. By applying a bending stress by sandwiching the split groove, the mother substrate is broken, thereby being divided into a wiring substrate. The split groove is formed, for example, by using a cutting knife or the like by a cutting knife or the like by a cutting cutter along the outer circumference of the outer surface of ...

AI Technical Summary

Problems solved by technology

That is, by forming through-holes for the positional deviation of the dividing grooves in the upper and lower surfaces, it is possible to make a multi-piece wiring board that is not easily affected by the positional deviation of the dividing grooves. In the case of a wiring board on which through holes are formed, in the processing of the dividing grooves by laser, the width of the dividing grooves is smaller than that of the conventional dividing grooves formed mechanically by using a mold or the like. Compared with a mother board in a wiring board region with a through-hole, a mother board in which a wiring board region without a through-hole is arranged has the problem that, when the position of the dividing groove is shifted, etc., the wiring board region Difficult to segment the corners of

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