A kind of thermal decomposition preparation method of thin film

Abstract

The invention discloses a thermal decomposition preparation method of a thin film. The thermal decomposition preparation method is characterized by comprising the following steps of a, designing a thin film preparation device; b, allowing the inlet end of a compression pipe to communicate with the aerosol output end of an atomizer and adding precursor liquid to be subjected to pyrolytic reaction into the atomizer; c, starting the atomizer first to atomize the precursor liquid to form aerosol; d, observing the reaction conditions of the interior through a quartz pipe and an upper cover plate during the pyrolytic reaction; and e, taking out a substrate after the substrate is cooled for a period of time. The preparation device used for the preparation method is provided with a deposition boatfor carrying the substrate horizontally. The deposition boat is provided with a pyrolytic reaction cavity used in cooperation with first heat resistance plates, second heat resistance plates and a contraction port of the compression pipe to enable a flow field and a temperature field of the pyrolytic reaction cavity to be constant, so that an airflow field and a temperature field near the surfaceof the substrate are kept constant, the smoothness of the pyrolytic reaction is ensured finally, and the film forming quality of the thin film is substantially improved.

Description

technical field [0001] The invention belongs to the field of film preparation, in particular to a method for preparing a film by thermal decomposition. Background technique [0002] In industrial production, it is often necessary to coat the surface of the substrate. The existing thin film preparation process mainly adopts thermal decomposition method. One thermal decomposition method uses a tube furnace to heat the substrate in the quartz tube. The substrate is arranged parallel or inclined along the axis of the quartz tube so that the precursor aerosol Species undergo pyrolysis reactions near the surface of the substrate, thereby attaching a thin film to the surface of the substrate. In addition, the thermal decomposition reaction is carried out under normal pressure or low pressure and vacuum environment. [0003] The defects of the existing thermal decomposition process are as follows: 1. We find that the existing thermal decomposition process cannot produce high-quali...

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Problems solved by technology

[0004] In addition, the existing thermal decomposition reaction is carried out in a low-pressure, vacuum environment, which leads to high equipment requirements and expensive equipment

Moreover, a relatively closed environment must be required for the pyrolysis reaction under very high pressure, which leads to more costs for continuous production, and the complexity of the equipment also leads to an increase in the failure rate

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