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An LED integrated packaging module with an integral array lens

An array lens and integrated packaging technology, which is applied to lighting devices, lighting device components, semiconductor devices of light-emitting elements, etc., can solve the problems of easily polluted electrode connection pads, complicated ways of fixing lenses, and short-circuited electrode connection pads.

Active Publication Date: 2020-07-07
SHENZHEN BIUE SPECTRUM RICK TECHNOIOGY CO LTD
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Problems solved by technology

[0002] The electrode connection pads of the existing high-power LED chip packaging modules are all set on the circuit layer, that is, the light emitting side of the LED chip, and the electrode connection pads are connected to the outside by welding. Pollution of the electrode connection pads may even lead to a short circuit between the electrode connection pads, destroying the LED chip, and there are potential safety hazards; the method of fixing the lens in the prior art is complicated, and the fixing lens is not firm enough

Method used

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  • An LED integrated packaging module with an integral array lens
  • An LED integrated packaging module with an integral array lens

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Embodiment Construction

[0035] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0036] It should be noted that when an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features.

[0037] see Figure 1 to F...

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Abstract

The invention provides an LED integrated packaging module with an overall arrayed type lens. The LED integrated packaging module comprises a base plate, a lens support, the overall arrayed type lens and a lens pressing sheet, the lens support is arranged above the base plate and wraps the base plate, the overall arrayed type lens is arranged above the lens support and connected with the lens support, and the lens pressing sheet is arranged above the overall arrayed type lens and presses the overall arrayed type lens to be connected with the lens support; the base plate comprises a line layer,a ceramic layer and a metal layer, the line layer is arranged above the ceramic layer and connected with the ceramic layer, the metal layer is arranged below the ceramic layer and connected with the ceramic layer, the two ends of the metal layer are provided with electrode connecting discs, and the electrode connecting discs are connected with the line layer and are connected with external components through pressing connection; and the line layer is provided with a plurality of LED chips, each lens unit is correspondingly arranged above the corresponding LED chip. The overall array lens can be replaced according to different using distances and light uniformities.

Description

technical field [0001] The invention relates to an LED integrated packaging module with an integral array lens. Background technique [0002] The electrode connection pads of the existing high-power LED chip packaging modules are all set on the circuit layer, that is, the light emitting side of the LED chip, and the electrode connection pads are connected to the outside by welding. Contamination of the electrode connection pads may even lead to a short circuit between the electrode connection pads, destroying the LED chip, and there are potential safety hazards; the way of fixing the lens in the prior art is complicated, and the fixing lens is not firm enough. [0003] The above deficiencies need to be improved. Contents of the invention [0004] In order to overcome the deficiencies of the existing technologies, the present invention provides an LED integrated packaging module with an integral array lens. [0005] Technical solution of the present invention is as follow...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21K9/20F21K9/69F21V5/04F21V19/00F21V23/06F21V17/12F21Y115/10
CPCF21K9/20F21K9/69F21V5/04F21V17/12F21V19/0025F21V23/06F21Y2115/10
Inventor 张河生
Owner SHENZHEN BIUE SPECTRUM RICK TECHNOIOGY CO LTD
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