Chip cutting and cleaning equipment

Abstract

The invention relates to the field of chip processing, in particular to chip cutting and cleaning equipment. The chip cutting and cleaning equipment comprises a cutting mechanism and a cleaning mechanism. The cleaning mechanism comprises a vertically-arranged cleaning disc. The middle of the cleaning disc is rotationally connected with a clamp used for clamping a wafer. The cleaning disc is provided with an annular sliding groove. The clamp is located at the circle center of the sliding groove. The sliding groove is slidably connected with a spraying head. A connecting rod is connected betweenthe clamp and the spraying head. The clamp is connected with a first motor used for driving the clamp to rotate. According to the chip cutting and cleaning equipment, the cleaning efficiency of the wafer in the cutting process is improved.

Description

technical field [0001] The invention relates to the field of chip processing, in particular to chip cutting and cleaning equipment. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. During the processing of the wafer, the surface of the wafer needs to be cut, so as to cut the surface of the wafer into several individual chips, and during the cutting process, the surface of the wafer forms cutting grooves. [0003] In the prior art, during the dicing process of the wafer, the debris generated by the wafer cutting needs to be cleaned. However, since the particles of the debris are relatively small, they are easy to adhere to the cutting groove on the wafer, so the debris of the debris is relatively small. It is difficult to clean up, and the cleaning efficiency of debris is low. Moreover, most of the current wafer cutting devices are CNC mac...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, during the dicing process of the wafer, the debris generated by the wafer cutting needs to be cleaned. However, since the particles of the debris are relatively small, they are easy to adhere to the cutting groove on the wafer, so the debris of the debris is relatively small. Difficult to clean and less efficient to clean debris

Moreover, most of the current wafer cutting devices are CNC machine tools. For small and medium-sized enterprises, the purchase cost of CNC machine tools is relatively high.

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