A polysilicon square cutting machine for single-layer wire mesh cutting

Abstract

The invention discloses a polycrystalline silicon squarer achieving cutting through a single-layer wire net and a cutting method of the polycrystalline silicon squarer. The polycrystalline silicon squarer for single-layer wire net cutting comprises a base, a material conveying platform, a first cutting mechanism, a truss mechanical arm and a second cutting mechanism, wherein the material conveyingplatform, the first cutting mechanism, the truss mechanical arm and the second cutting mechanism are arranged on the base. The material conveying platform comprises a feeding trolley, a discharging trolley and a cutting platform arranged between the feeding trolley and the discharging trolley. The first cutting mechanism is arranged above the cutting platform. The second cutting mechanism is arranged at the rear end of the discharging trolley. The truss mechanical arm is arranged above the discharging trolley and the second cutting mechanism. According to the polycrystalline silicon squarer,a material can be cut into a square ingot through two times of cutting, the single-layer wire net is adopted for cutting, the use length of a cutting steel wire is greatly reduced, and the cutting stroke is reduced; and the wire net is not shorn after cutting, continuous cutting of a silicon ingot is guaranteed, automation is improved, unmanned intervention is achieved, and the manual cost is reduced.

Description

technical field [0001] The invention relates to the technical field of crystal silicon cutting, in particular to a single-layer wire net cutting polysilicon square rooting machine. Background technique [0002] In the photovoltaic industry, both monocrystalline and polycrystalline silicon industries require a square cutting machine to process silicon materials. The processing process of the square cutting machine mainly uses cutting lines to cut large silicon materials into quasi-silicon blocks. The square cutting machine in the prior art adopts vertical square cutting. First, the bar is glued to the crystal holder, then the crystal holder is fixed on the tray, and finally the cutting head cuts from top to bottom. Cutting silicon ingots or silicon rods into square rods (quasi-silicon blocks); the cutting time is long, and the bonding and cutting of silicon rods takes a lot of labor and time. After the cutting is completed, the machine head cannot be returned directly, and th...

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Problems solved by technology

The square cutting machine in the prior art adopts vertical square cutting. First, the bar is glued to the crystal holder, then the crystal holder is fixed on the tray, and finally the cutting head cuts from top to bottom. Cutting silicon ingots or silicon rods into square rods (quasi-silicon blocks); the cutting time is long, and the bonding and cutting of silicon rods takes a lot of labor and time. After the cutting is completed, the machine head cannot be returned directly, and the wire mesh needs to be cut to The tray is pulled out for blanking, and the wire mesh cannot be reused after being cut off, resulting in a waste of consumables. In addition, the bar must be degummed during blanking, which is cumbersome and inconvenient to operate. Generally speaking, the traditional square cutting machine process Complicated, long auxiliary time, high labor cost, low production efficiency, high wire consumption, difficult threading, and inconvenient operation

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