Method for constructing environmentally-friendly water-saving gum residue-removing electroless copper deposition line
A technology of chemical copper deposition and slag, which is applied in the cleaning/polishing of conductive patterns, secondary treatment of printed circuits, etc. Product quality, reducing the amount of addition, reducing the effect of pollution concentration
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[0034] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, a clear and complete description will be made below in conjunction with the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, and Not all examples. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0035] Therefore, the detailed description of the embodiments of the invention is not intended to limit the scope of the invention as claimed, but to represent only selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present ...
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