Contact type cooling system adopting shape memory alloy

A memory alloy and cooling system technology, applied in the field of low-temperature cooling systems, can solve the problems of increased energy consumption and unstable operation of cooling devices, achieve simple structure, improve performance, avoid frequent start and stop or use complex frequency conversion technology Effect

Inactive Publication Date: 2018-11-23
ZHEJIANG UNIV
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  • Abstract
  • Description
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Problems solved by technology

[0005] Because the current cooling system still has the above-mentioned deficiencies, or the energy consumption of the cooling device increases due to frequent startup and shutdown, and the operation is unstable, or the setting range of the temperature threshold is wide, and a thermometer and program control are required to control the temperature. Therefore, in order to better provide object-oriented cooling capacity, a simple structure is needed to simplify and improve the performance of the cooling system

Method used

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  • Contact type cooling system adopting shape memory alloy
  • Contact type cooling system adopting shape memory alloy
  • Contact type cooling system adopting shape memory alloy

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Embodiment Construction

[0022] A contact cooling system using a shape memory alloy of the present invention will be further described in detail below in conjunction with the drawings and specific embodiments.

[0023] Such as figure 1 As shown, a contact cooling system using a shape memory alloy includes a refrigeration device 1 for providing cooling capacity, a shape memory alloy 2 , an object to be cooled 3 , and a vacuum dewar 4 . One end of the shape memory alloy 2 is fixed on the bottom plate, and is fixedly connected with the cooled object 3 through the bottom plate, and the other end is in contact with the refrigeration device 1 . Among them, the cold energy provided by the refrigeration device 1 is transferred to the shape memory alloy 2, and then transferred to the object to be cooled 3 through the bottom plate, so as to achieve the purpose of refrigeration. All three are placed in the vacuum dewar bottle 4, which is used to isolate the heat leakage of the environment.

[0024] In this emb...

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Abstract

The invention discloses a contact type cooling system adopting a shape memory alloy. The contact type cooling system comprises a cooling device for providing cold, a cooled object, the shape memory alloy and a vacuum Dewar bottle. The cooling device for providing cold, the cooled object and the shape memory alloy are all arranged in the vacuum Dewar bottle, the cooled object and the cooling devicefor providing are in contact and out of contact through prolonging and shortening of the shape memory alloy at about the critical temperature, the cooled object is maintained at the critical conversion temperature, and heat leakage is reduced. Compared with a traditional cooling system, by means of the contact type cooling system, a temperature gauge and a control logic are avoided, frequent start and stop of the device for providing cold are avoided, system operation is more stable, and the overall performance of the cooling system is improved.

Description

technical field [0001] The invention relates to the field of low-temperature cooling systems, in particular to a contact cooling system using shape memory alloys. Background technique [0002] In the case of the country's vigorous development of military, medical and aerospace, cryogenic cooling has increasingly taken up a pivotal position. Various high-tech equipment has increasingly stringent requirements for cryogenic cooling equipment, more precise temperature control, Smaller vibration, longer running time, and more reliable technology are attracting more and more attention from people. How to more effectively control the temperature of the cooled object and reduce energy consumption has significant significance. [0003] At present, the commonly used method is to install a thermometer to collect the temperature of the measured object. Through the DLC control logic, when the temperature is higher than the set temperature, the device that provides cooling capacity is tu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F25B9/14
CPCF25B9/14
Inventor 尤晓宽邱利民陶希军植晓琴
Owner ZHEJIANG UNIV
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