Sinterable conductive composition, method of improving electrical conductivity of composition, and substrate
A conductive composition, a technology of the composition, applied in the direction of conductive materials, circuit substrate materials, non-metallic conductors, etc. dispersed in non-conductive inorganic materials
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0075] The composition was prepared by mixing nanoparticulate silver (7K-35, with a surfactant alcoholic solvent called DOWANOL from Ferro Corporation, OH) into a polymethylmethacrylate emulsion (10 % PMMA, PMMA average particle size 61 nm, obtained from Magsphere Corporation, CA). Add sintering aid H to sample number 1 3 PO 4 (10% by weight in water), followed by mixing at 3000 rpm for 60 seconds. As a control, Control 1 was used to compare the performance relative to Sample No. 1. Scanning electron microscope ("SEM") images were acquired using a Hitachi S-4500 field emission SEM and are shown at figure 1 middle.
[0076] Table 1
[0077]
[0078] Each of the compositions in Table 1 was applied to a glass slide and prepared as described herein to allow volume resistivity measurements.
[0079] The volume resistivity ("VR") of the prepared compositions was measured by standard strip method. Each sample for the strip conductivity test was prepared by first coating a t...
Embodiment 2
[0086] Four compositions were prepared by mixing nanoparticulate silver (7K-35 from Ferro Corporation, Mayfield Heights, OH) into a polystyrene emulsion (10% polystyrene in water, the average particle size of polystyrene 62nm, 200nm and 600nm from Magsphere Corporation, Pasadena, CA). Addition of sintering aid H to samples 2, 3 and 4 3 PO 4 (10% by weight in water) followed by mixing at 3000 rpm for a period of 60 seconds. The compositions thus formed were used to prepare test samples.
[0087] Table 2
[0088]
[0089] Table 2A shows the volume resistivity (in ohm·cm) measurements for Control 2 listed in Table 2 above, as well as the three inventive compositions (ie, Samples 2, 3 and 4). The composition was heated for 30 minutes at a temperature of 120°C.
[0090] Table 2A
[0091]
[0092] Table 2A shows that after curing at 120°C for 30 minutes, the sintering aid (H 3 PO 4 aqueous solution) reduces the volume resistivity of silver inks formulated with polystyr...
Embodiment 3
[0094] Here, two compositions were prepared by mixing nanoparticulate silver (7K-35 from Ferro Corporation) into polymethyl methacrylate emulsion (10% PMMA in water, PMMA average particle size 61 nm). Choice of two different sintering aids - H 3 PO 4 and KI (both 10% by weight in water). Sintering aid was added to samples 5 and 6 and then mixed at 3000 rpm for 60 seconds. The compositions thus formed were used to prepare test samples.
[0095] table 3
[0096]
[0097] Table 3A shows the volume resistivity (in ohm·cm) measurements for the two inventive compositions listed in Table 3 above (ie, Samples 5 and 6). The composition was cured for 30 minutes at a lower temperature than before—at 80°C instead of 120°C.
[0098] Table 3A
[0099]
[0100] Table 3A shows that each combination of polymer emulsion and sintering aid decreased the volume resistivity of the silver nanoparticle coatings (Samples 5 and 6) compared to Control 1 (Table 1A).
PUM
| Property | Measurement | Unit |
|---|---|---|
| particle size | aaaaa | aaaaa |
| particle size | aaaaa | aaaaa |
| particle size | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More