Method for separating flexible circuit board from OLED (Organic Light Emitting Diode) display panel
A flexible circuit board and display panel technology, which is used in secondary processing of printed circuits, maintenance/correction of printed circuits, instruments, etc., can solve the problem of poor adhesion between flexible circuit boards and OLED display panels, increase production costs, and separate flexible circuits. Problems such as low board success rate
Active Publication Date: 2018-11-30
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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Problems solved by technology
In the existing technology, if the yield rate of the bending process is low, the adhesion between the flexible circuit board and the OLED display panel is not good. At present, there is no alternative solution for defective products, that is, the yield rate of the bending process is low. OLED display, rework (rework)
[0004] In the existing liquid crystal display, the technology used is to heat the flexible circuit board and tear the flexible circuit board. Because the heating temperature is too high, the flexible circuit board will be curled and become a defective product.
In addition, because the OLED display panel and the flexible circuit board are bonded by an adhesive layer, tearing the flexible circuit board from the OLED display panel by a large external force will damage the flexible circuit board, making the success rate of separating the flexible circuit board relatively low. low, increased production costs
Method used
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[0026] In order to make the above and other objectives, features, and advantages of the present disclosure more comprehensible, preferred embodiments of the present disclosure will be exemplified below in detail with reference to the attached drawings. Furthermore, the direction terms mentioned in this disclosure, such as up, down, top, bottom, front, back, left, right, inside, outside, side layer, surrounding, center, horizontal, transverse, vertical, longitudinal, axial , radial direction, the uppermost layer or the lowermost layer, etc., are only directions for referring to the attached drawings. Therefore, the directional terms used are used to explain and understand the present disclosure, but not to limit the present disclosure.
[0027] In the figures, structurally similar units are denoted by the same reference numerals.
[0028] refer to figure 1 , an embodiment of the present disclosure provides a method for separating a flexible circuit board and an OLED display p...
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The invention provides a method for separating a flexible circuit board from an OLED (Organic Light Emitting Diode) display panel. The method comprises the steps: providing the flexible circuit boardand the OLED display panel which are laminated to each other, wherein the flexible circuit board comprises a first bent component, a metallic layer, an adhesive glue layer and a second bent componentwhich are arranged sequentially from bottom to top, the adhesive glue layer adheres the metallic layer and the second bent component, and the first bent component is laminated to the surface of the OLED display panel; subjecting the adhesive glue layer to laser irradiation, so as to enable the adhesive glue layer to lose adhesivity; separating the second bent component from the metallic layer. According to the method, the adhesive glue layer can be subjected to laser irradiation to enable the adhesive glue layer to lose adhesivity, and then, the second bent component is separated, so that thedamage to the second bent component caused by separation is avoided.
Description
【Technical field】 [0001] The disclosure relates to the field of display technology, in particular to a method for separating a flexible circuit board and an OLED display panel. 【Background technique】 [0002] Organic light emitting diode (OLED) display, also known as organic electroluminescence display, is an emerging flat panel display device, due to its low power consumption, high luminous brightness, light and thin volume, fast response and easy It has the advantages of flexible display and so on, so it has broad application prospects. [0003] In the prior art, the bending process of the OLED display may be to form the curved surface during the packaging process of the OLED display panel, or to form the curved surface after the OLED display panel manufacturing process is completed. In the existing technology, if the yield rate of the bending process is low, the adhesion between the flexible circuit board and the OLED display panel is not good. At present, there is no al...
Claims
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IPC IPC(8): G09F9/30G09F9/33H05K3/22
CPCG09F9/301G09F9/33H05K3/225
Inventor 李建伟
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD