Silicon wafer sucking assembly and silicon wafer grabbing mechanism
A grabbing mechanism and technology for silicon wafers, applied in the manufacture of electrical components, semiconductor devices, semiconductor/solid-state devices, etc., can solve the problems of low grabbing efficiency of silicon wafers, limited scope of application, and reduced production efficiency, etc. The effect of grasping efficiency, reducing production cost and improving production efficiency
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Embodiment 1
[0024] see figure 1 and figure 2 , the present invention provides a silicon wafer suction assembly 1, which can be installed on a silicon wafer grabbing mechanism for sucking silicon wafers of solar cells, so as to insert the silicon wafers into the carrying flower basket / carrying boat or self-supporting flower basket / carrying boat out. figure 1 Shows the front view structure of the silicon wafer suction assembly 1 in the embodiment of the present invention, the silicon wafer suction assembly 1 includes a sheet-shaped housing 10, and a mounting part 11 is arranged on the upper side of the housing 10 , a silicon wafer suction part 12 is provided on the lower side of the housing 10, the silicon wafer suction assembly 1 is installed on the silicon wafer grabbing mechanism through the installation part 11, and the solar energy is absorbed by the silicon wafer suction part 12 Silicon wafers for batteries.
[0025] Wherein, the silicon wafer suction part 12 includes a front side...
Embodiment 2
[0041] see image 3 and Figure 4 , the present invention also provides a silicon wafer grasping mechanism 2 using the above-mentioned silicon wafer suction assembly 1, which is used to grasp the silicon wafer and insert it into the carrying flower basket / carrying boat or grab the silicon wafer from the carrying flower basket / carrying boat and pull out, image 3 and Figure 4 Shows the structure of the silicon wafer gripping mechanism 2 in the embodiment of the present invention, the silicon wafer gripping mechanism 2 includes a first support 21 and a second support 22 arranged side by side horizontally, at the bottom of the first support 21 A first grasping part 210 is installed, and a second grasping part 220 is installed at the bottom of the second bracket 22 , and the first grasping part 210 and the second grasping part 220 are horizontally arranged side by side.
[0042] The first gripping part 210 includes a plurality of silicon wafer suction assemblies 1 (1) arranged...
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