An electronic device and its casing and casing assembly

Abstract

The present application provides an electronic device and its housing and housing assembly. The housing includes a bottom wall and a peripheral side wall. The bottom wall is connected to the peripheral side wall to form an accommodating space. The peripheral side wall includes The dispensing surface is set in the direction of the opening, the width of the dispensing surface is less than or equal to the width threshold, and there are multiple overflow grooves set at intervals, and the multiple overflow grooves are used to pass through the dispensing surface on the cover plate of the electronic equipment When the glue is pressed against the dispensing surface, it receives the glue overflowing from the dispensing surface. Through the housing, when the width of the glue dispensing surface is less than or equal to the width threshold, compared with the prior art, a whole glue overflow groove formed on the glue dispensing surface reduces the difficulty of forming.

Description

technical field [0001] The present application relates to the technical field of electronic equipment, in particular to an electronic equipment, its housing, and housing components. Background technique [0002] The shell and back cover of electronic equipment are usually pressed together by adhesive. In order to prevent the glue from overflowing to the surface or inside of the electronic equipment during the pressing process, a strip is generally set on the dispensing surface of the shell. There is a ring-shaped overflow groove, but with the increasing application of narrow frame technology, the width of the dispensing surface is too small, which increases the difficulty of the process when forming a whole overflow groove. Contents of the invention [0003] An embodiment of the present application provides a case of an electronic device on the one hand, the case includes a bottom wall and a peripheral side wall, the bottom wall is connected to the peripheral side wall to ...

AI Technical Summary

Problems solved by technology

[0002] The shell and back cover of electronic equipment are usually pressed together by adhesive. In order to prevent the glue from overflowing to the surface or inside of the electronic equipment during the pressing process, a strip is generally set on the dispensing surface of the shell. Ring-shaped overflow groove, but with the increasing application of narrow frame technology, the width of the dispensing surface is too small, resulting in increased process difficulty when forming a whole overflow groove

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