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Spaceflight inertia piece double-hole feature fine grinding temperature measurement device

A grinding temperature and measuring device technology, which is applied to the parts of grinding machine tools, grinding/polishing equipment, and machine tools designed for grinding the rotating surface of workpieces, etc., can solve the problem that it is difficult to accurately infer temperature changes, etc. Achieve the effects of avoiding damage, reducing interference, and easy operation efficiency

Active Publication Date: 2018-12-07
UNIV OF SHANGHAI FOR SCI & TECH
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  • Summary
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  • Claims
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AI Technical Summary

Problems solved by technology

At present, the measurement method of grinding temperature is mainly carried out from two aspects, one is direct measurement, and the other is indirect measurement, which is to deduce the temperature of the grinding process by analyzing the composition change of the surface of the ground part. This method is difficult to accurately infer the temperature change during the grinding process due to the interference of many factors such as processing materials and processing time.

Method used

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  • Spaceflight inertia piece double-hole feature fine grinding temperature measurement device
  • Spaceflight inertia piece double-hole feature fine grinding temperature measurement device
  • Spaceflight inertia piece double-hole feature fine grinding temperature measurement device

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Embodiment Construction

[0028] The working principle of the present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0029] Such as Figure 1 to Figure 6 As shown, a micro-grinding temperature measurement device for aerospace inertial parts is composed of a temperature sensor 100 and an auxiliary device. The auxiliary device includes a clamping part 200, an XYZ displacement part 300, a grating and its fixing part 400.

[0030] The temperature sensor 100 is installed on the XYZ displacement part 300 through the clamping part 200, and the temperature sensor 100 is located on one side of the XYZ displacement part 300, and the other side of the XYZ displacement part 300 places the grating and its fixing part 400, and three of the gratings The grating ruler 3 is respectively placed in the directions of XYZ three axes to measure the displacement. Such as Figure 7 , as shown in 8, the temperature sensor 100 includes a bipolar thermocoup...

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Abstract

The invention relates to a spaceflight inertia piece double-hole feature fine grinding temperature measurement device. The spaceflight inertia piece double-hole feature fine grinding temperature measurement device is composed of a temperature sensor and an auxiliary device. The auxiliary device comprises a clamping component, an XYZ displacement component, an optical grating and a fixing piece component of the optical grating. The temperature sensor is arranged on the XYZ displacement component through a clamping component, the temperature sensor is located on one side of the XYZ displacementcomponent, and the optical grating and the fixing piece component of the optical grating are arranged on the other side of the XYZ displacement component. A cylinder-shaped thermocouple carrier is adopted in the temperature sensor, and a twin pole thermocouple is inserted in the thermocouple carrier; in the machining process, at the connection position of the thermocouple and the workpiece surface, the workpiece surface temperature can be effectively measured, and the temperature in the machining process is monitored in real time. Damage to the workpiece weak position is avoided. The interference on the temperature measurement from the workpiece shape feature can be reduced to the minimum. For the current high-precision and high-efficiency machining requirements, the important significanceis achieved for guaranteeing the spaceflight inertia piece machining quality through the studied temperature measurement technology.

Description

technical field [0001] The invention relates to a grinding temperature measuring device, in particular to a device for accurately measuring the grinding temperature generated during the double-hole micro-grinding process of aerospace inertial parts. Background technique [0002] The key features of the formation of double holes in the grinding process of aerospace inertial parts are the complex structure and small size of the processed parts, and the energy dissipation produces plastic deformation in the grinding area. In this area, the temperature of the grinding wheel or workpiece rises at a very high temperature rate. According to the nature of the material, excessive temperature will cause a series of hazards such as thermal damage on the surface of the workpiece, causing plastic deformation and affecting the accuracy of the part. Therefore, the grinding temperature is one of the most important factors to control the surface quality of the parts after the grinding proces...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B5/48B24B49/00
CPCB24B5/48B24B49/00
Inventor 丁子珊李兆瑞郭淼现江小辉李郝林
Owner UNIV OF SHANGHAI FOR SCI & TECH
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