Electronic device based on SOI CMOS, preparation method and peeling method thereof

A technology of electronic devices and substrate substrates, which is applied in the field of preparation and SOICMOS-based electronic devices, can solve the problems of complex manufacturing process, difficult manufacturing, and low yield rate, so as to reduce manufacturing cost, reduce manufacturing process difficulty, and improve yield rate Effect
CN108962918AActive Publication Date: 2018-12-07NO 24 RES INST OF CETC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
NO 24 RES INST OF CETC
Publication Date
2018-12-07

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Abstract

The invention provides an electronic device based on an SOI CMOS, a preparation method and a peeling method thereof. The electronic device based on the SOI CMOS is provided with a plurality of peelingtroughs. The peeling troughs penetrate through the electronic device based on the SOI CMOS. Not only is manufacture of the electronic device based on the SOI CMOS facilitated, but also a stress in bending is reduced. Damage of the electronic device based on SOI CMOS is prevented. Through arranging the peeling troughs and arranging the peeling troughs which are trough to an embedded oxide layer, and performing corrosion processing on the embedded oxide layer, corrosion of the embedded oxide layer is realized; and furthermore the electronic device based on the SOI CMOS is disengaged from a substrate. The electronic device based on the SOI CMOS forms a suspended structure through supporting by a support. Manufacturing process difficulty and manufacturing cost are reduced. The electronic device is peeled to a target substrate through a PDMS stamp.
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Description

technical field

[0001] The invention relates to the technical field of semiconductor manufacturing, in particular to an electronic device based on SOI CMOS, a preparation method and a stripping method. Background technique

[0002] With the development of semiconductor manufacturing technology, electronic devices capable of conforming to the three-dimensional (3D) topography of biological surfaces have unique physical properties and are therefore favored by academia and industry. First of all, such electronic devices have ultra-thin properties in physical structure, so that such electronic devices are flexible and even bendable, so they have great application prospects in the fields of wearable electronics and medical diagnosis; moreover, such electronic devices When the device is stimulated by the external stress field, it will undergo geometric deformation, and this geometric deformation will be coupled into the electrical transport characteristics of the electronic device...

Claims

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