The application discloses a novel
electrode preparation and wiring process combining
indium compression contact and hot air
welding method, and relates to the technical field of condensed state
physics and material
engineering. The application comprises the following steps: S1:
processing a
millimeter-level bulk phase material sample to be measured into a regular long strip-shaped Hallbar structure for
electrical transport measurement, and performing cleaning treatment on the surface of the processed sample. The application cooperates
indium compression contact and hot air
welding, relies on the good
ductility and
low resistance characteristics of high-purity
indium, forms a gap-free
ohmic contact between indium and the surface of the
millimeter-level bulk phase sample under
constant pressure at
room temperature, simultaneously utilizes the
low melting point characteristics of Sn-Bi series low-temperature
soldering paste, forms a metallurgical bonding solder joint structure between the
metal wire and the indium
electrode through a precise
temperature control hot air
welding process, and forms a mutual melting
diffusion layer, which effectively solves the problem of loose contact. Compared with a single
contact mode, the application not only retains the
advantage of small
thermal damage of the indium
compression method to the sample, but also has high
mechanical stability of the welding connection.