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A drilling method for preventing needle breakage of micro-drill

A drilling method and a needle breaking technology, which are applied in the field of drilling to prevent needle breakage by micro-drilling, can solve the problems of easy occurrence of broken needle drilling efficiency and need to be further improved, and achieve the effect of improving drilling efficiency

Active Publication Date: 2020-07-24
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problems that the existing drilling method is prone to broken needles and the drilling efficiency needs to be further improved, and provides a drilling method for preventing broken needles, especially the effect of preventing broken needles in micro-hole drilling is remarkable, and can improve drilling efficiency

Method used

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  • A drilling method for preventing needle breakage of micro-drill

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Embodiment

[0016] This embodiment provides a kind of drilling method that prevents micro-drilling from breaking the needle. The production board for drilling in this embodiment is a 10-layer board. 0.3mm hole, among which, in the hole with a diameter of 0.3mm, some holes are used to connect to 4 layers of circuit layers (drilling through 4 layers of PAD when drilling), and some holes are used to connect to 10 layers of circuit layers. wear 10 layers of PAD), such as figure 1 shown.

[0017] Drilling steps are as follows:

[0018] (1) Mark the hole with a diameter of 0.3mm that needs to be made on the production board as the first drill hole or the second drill hole, where the first drill hole is a hole used to connect the circuit layer with 4 layers, and the second drill hole Drilling holes are used to connect 10 layers of circuit layers.

[0019] The specific operation in production is as follows: Use the graphics processing software (CAM350 / GENESIS) commonly used in circuit board pr...

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Abstract

The invention relates to the technical field of manufacturing of circuit boards, in particular to a drilling method for preventing breaking of needles of a micro drill. According to the method, the layer number of copper layers required to be drilled through by the drilling needles during drilling is used as a standard, holes which are same in aperture and are required to be formed in a productionboard are divided into two types, the holes are the first drilling holes when the layer number of the copper layers required to be drilled through is smaller than or equal to 4, the holes are the second drilling holes when the layer number of the copper layers required to be drilled through is greater than 4, correspondingly different drilling parameters are adopted for drilling to obtain the first drilling holes and the second drilling holes, and thus the problem is solved that the needles are easily broken when the holes having a large number of the copper layers required to be drilled through are formed. The efficiency of drilling the first drilling holes can be improved by increasing the drilling tool speed in the first drilling parameters.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a drilling method for preventing broken needles of micro drills. Background technique [0002] With the refinement of electronic product lines and the development of miniaturization, micro-drilling (diameter of the drill used for drilling ≤ 0.4mm) is increasing in the production of circuit boards, and printed circuit boards are used to conduct different circuit layers. For wiring and installing electronic components, design the inner layer copper PAD in advance when making the inner layer graphics at the drilling position. Since holes in different areas need to connect to different layers of circuit layers, when drilling holes with the same diameter, it is necessary to drill the PAD. The number of copper layers to be drilled is different, but in actual production, it is mainly distinguished by the size of the aperture. The holes with the same aperture are drilled...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23B35/00
CPCB23B35/00
Inventor 莫崇明黄小玲孙保玉
Owner SHENZHEN SUNTAK MULTILAYER PCB