A bearing device and a semiconductor processing apparatus

A technology for carrying devices and processing equipment, which is applied in semiconductor/solid-state device manufacturing, metal material coating technology, ion implantation plating, etc., can solve problems affecting production costs and equipment capacity, and achieve uniform and stable temperature. stable effect

Active Publication Date: 2018-12-11
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This operation of stopping the process cooling will greatly affect the production cost and equipment capacity

Method used

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  • A bearing device and a semiconductor processing apparatus
  • A bearing device and a semiconductor processing apparatus
  • A bearing device and a semiconductor processing apparatus

Examples

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Embodiment Construction

[0033] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0034] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0035] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0036] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The invention provides a bearing device and a semiconductor processing device. The bearing device includes a heating pan, a spacer and a cooling pan, wherein the spacer is positioned between the heating pan and the cooling pan to partition an area between the heating pan and the cooling pan into at least one insulating area and at least one heat transfer area. At least one heat insulation region and at least one heat transfer region can be separate from each other by a separator, and that excess heat caused by the metal ion deposited on the workpiece to be processed can be carried away by thearrangement of the heat transfer region; At the same time, a large amount of heat transfer between the heating plate and the cooling plate can be limited by the setting of the heat insulation zone, sothat the temperature of the bearing device can be kept uniform and stable in the whole process, so that the qualified and stable process temperature can be provided for the workpiece to be processed,and the better process result can be obtained finally.

Description

technical field [0001] The present invention relates to the field of semiconductor processing, and more specifically, to a carrying device and semiconductor processing equipment. Background technique [0002] With the continuous development of the semiconductor industry, semiconductor manufacturing processes have become more and more diverse. No matter what kind of process, temperature is an extremely important part, which directly affects equipment cost and production capacity. [0003] Usually, in the process of processing semiconductors, it is necessary to place wafers on a carrier device of semiconductor processing equipment. The heating function of the carrier device is used to heat the wafer to the process temperature and maintain the process temperature during the process. [0004] In actual operation, it is difficult to effectively control the temperature of the carrying device due to the influence of the process gas and the process. For example, in a physical vap...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/67
CPCH01L21/67011H01L21/683C23C14/50C23C16/4586C23C16/466H01J37/32724H01L21/67103H01L21/67109H01L21/68785C23C14/541H01L21/67366H01L21/67383H01L21/67393
Inventor 常青李冰赵梦欣
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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