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A high-heat-dissipating air-type bus duct and a preparation method thereof

A technology of high heat dissipation and busway, applied in the direction of electrical components, etc., can solve the problems of affecting the service life of the busbar, low heat dissipation efficiency, high ambient temperature, etc., and achieve the effect of improving insulation effect, improving heat dissipation efficiency, and good permeability resistance

Inactive Publication Date: 2018-12-11
江苏大印电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The busbar will generate a lot of heat during use. If the heat cannot be dissipated to the outside of the busway in time, the ambient temperature of the busbar will be high. Long-term exposure to high temperature will seriously affect the service life of the busbar.
The existing air-type busway has a small heat dissipation area, and the heat can only be dissipated from the gap between the busbars to the outside of the busway, and the heat dissipation efficiency is low

Method used

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  • A high-heat-dissipating air-type bus duct and a preparation method thereof
  • A high-heat-dissipating air-type bus duct and a preparation method thereof
  • A high-heat-dissipating air-type bus duct and a preparation method thereof

Examples

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Effect test

Embodiment 1

[0032] This embodiment provides a high heat dissipation air type bus duct, including an upper cover 1, a lower cover 2, a left side 3 and a right side 4, an upper cover 1, a lower cover 2, and a left side 3 And the right side plate 4 encloses a wire chamber 5, a busbar 6 is installed in the wire chamber 5, and an insulating partition 11 is arranged between the busbar 6, the upper cover plate 1, and the lower cover plate 2. A rectangular through hole 13 is provided on the upper cover plate 1, the lower cover plate 2, the left side plate 3 and the right side plate 4, and a heat dissipation cavity 7 is arranged on each rectangular through hole 13, and the heat dissipation cavity 7 is formed by the top plate 8. Surrounded by four connecting plates 9, the top plate 8 is also rectangular, and the four connecting plates 9 connect the rectangular through hole 13 with the top plate 8, so that the heat dissipation chamber 7 communicates with the line chamber 5.

[0033] Wherein, the len...

Embodiment 2

[0043]This embodiment provides a high heat dissipation air type bus duct, including an upper cover 1, a lower cover 2, a left side 3 and a right side 4, an upper cover 1, a lower cover 2, and a left side 3 And the right side plate 4 encloses a wire chamber 5, a busbar 6 is installed in the wire chamber 5, and an insulating partition 11 is arranged between the busbar 6, the upper cover plate 1, and the lower cover plate 2. A rectangular through hole 13 is provided on the upper cover plate 1, the lower cover plate 2, the left side plate 3 and the right side plate 4, and a heat dissipation cavity 7 is arranged on each rectangular through hole 13, and the heat dissipation cavity 7 is formed by the top plate 8. Surrounded by four connecting plates 9, the top plate 8 is also rectangular, and the four connecting plates 9 connect the rectangular through hole 13 with the top plate 8, so that the heat dissipation chamber 7 communicates with the line chamber 5.

[0044] Wherein, the leng...

Embodiment 3

[0054] This embodiment provides a high heat dissipation air type bus duct, including an upper cover 1, a lower cover 2, a left side 3 and a right side 4, an upper cover 1, a lower cover 2, and a left side 3 And the right side plate 4 encloses a wire chamber 5, a busbar 6 is installed in the wire chamber 5, and an insulating partition 11 is arranged between the busbar 6, the upper cover plate 1, and the lower cover plate 2. A rectangular through hole 13 is provided on the upper cover plate 1, the lower cover plate 2, the left side plate 3 and the right side plate 4, and a heat dissipation cavity 7 is arranged on each rectangular through hole 13, and the heat dissipation cavity 7 is formed by the top plate 8. Surrounded by four connecting plates 9, the top plate 8 is also rectangular, and the four connecting plates 9 connect the rectangular through hole 13 with the top plate 8, so that the heat dissipation chamber 7 communicates with the line chamber 5.

[0055] Wherein, the len...

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Abstract

A high-heat-dissipating air-type bus duct in accordance with that present invention, include an upper cover plate, a Lower cover panel, a left panel and right panel, The upper cover plate, the lower cover plate, the left side plate and the right side plate are enclosed into a line accommodation cavity, a bus bar is installed in the line accommodation cavity, a heat dissipation cavity is arranged on the upper cover plate and the lower cover plate, the heat dissipation cavity comprises a top plate and a connecting plate connecting the top plate with the upper cover plate and the lower cover plate, the heat dissipation cavity is communicated with the line accommodation cavity, and a heat dissipation hole is arranged on the connecting plate. The invention also discloses a preparation method ofa high heat dissipation air type bus duct, which not only improves the strength of the bus duct, but also effectively improves the heat dissipation efficiency of the bus duct and prolongs the servicelife of the bus duct.

Description

technical field [0001] The invention relates to the technical field of electric equipment, in particular to a high heat dissipation air type bus duct and a preparation method thereof. Background technique [0002] With the emergence of modern engineering facilities and equipment, the power consumption of all walks of life is increasing rapidly, especially the emergence of many high-rise buildings and large factory buildings. The traditional cables used as power transmission wires can no longer meet the requirements in the current high-current transmission system. The parallel use of multi-channel cables has brought a lot of inconvenience to the on-site installation and construction connections. Bus ducts have increasingly replaced wires and cables in indoor low-voltage power transmission trunk line projects. [0003] The busbar will generate a lot of heat during use. If the heat cannot be dissipated to the outside of the busway in time, the ambient temperature of the busbar ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02G3/04H02G3/03C04B35/10C08L63/00C08L75/04C08K13/02C08K3/22C08K3/38C08K3/26C08K3/36C08K5/523
CPCC04B35/10C04B2235/3206C04B2235/3418C04B2235/386C04B2235/442C04B2235/945C04B2235/96C08K2003/2224C08K2003/2227C08K2003/265C08K2003/385C08L63/00C08L2201/02C08L2201/08H02G3/03H02G3/0487C08L75/04C08K13/02C08K3/22C08K3/38C08K3/26C08K3/36C08K5/523
Inventor 黄长军严伟常慧
Owner 江苏大印电子科技有限公司
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