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Welding method for sputtering target material

A sputtering target material and welding method technology, which is applied in welding equipment, non-electric welding equipment, metal processing equipment, etc., can solve the problems of high cost of sputtering target material and restrictions on the development of chip manufacturing, so as to reduce costs and ensure success rate , High welding effect

Pending Publication Date: 2018-12-14
宁波顺奥精密机电有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the defects in the prior art that the cost of the sputtering target itself is high and restrict the development of chip manufacturing, the present invention provides a sputtering target welding method, the purpose of which is to combine the sputtering target in the prior art One-piece molding, replace the sputtering target auxiliary material with relatively cheap aluminum and other materials, and then weld the aluminum auxiliary material and the sputtering target main material, which saves the cost of raw materials, and the welding method adopted is in the scale The cost will also be reduced during large-scale production, so that low-cost sputtering targets can be produced on a large scale, and when the target is used in chip manufacturing, the cost of chip manufacturing will be greatly reduced

Method used

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Experimental program
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Effect test

Embodiment 1

[0017] Embodiment 1: A sputtering target welding method provided by the present invention comprises the following steps:

[0018] (1) Adjust the welding gap between the main material and the auxiliary material of the sputtering target to 0.3mm;

[0019] (2) Welding with a friction stir welding machine: insert the rotary cutter on the friction stir welding machine into the welding gap to a depth of 10.5 mm, and rotate the rotary cutter for welding. During the rotary welding of the rotary cutter, the auxiliary material rotates with the main material.

[0020] Compared with any welding method of the prior art, the welding method of the present invention has an average welding success rate of 98%, while the average success rate of the prior art welding method is 40%. Good welds together form the sputtering target.

Embodiment 2

[0021] Embodiment 2: A sputtering target welding method provided by the present invention comprises the following steps:

[0022] (1) Adjust the welding gap between the main material and the auxiliary material of the sputtering target to 0.2mm;

[0023] (2) Welding with a friction stir welding machine: Insert the rotary cutter on the friction stir welding machine into the welding gap to a depth of 11mm, and the rotary cutter rotates for welding. During the rotary welding of the rotary cutter, the auxiliary material rotates with the main material.

[0024] Preferably, the auxiliary sputtering target material is aluminum. The rotation speed of the rotary cutter in the step (2) is 1400 rpm. The speed at which the main material rotates in the step (2) is 115mm / min. The soldering temperature is 617°C.

[0025] Adopting aluminum material to replace the materials in the prior art of auxiliary materials can greatly reduce the cost of raw materials. Compared with any welding method ...

Embodiment 3

[0026] Embodiment 3: A sputtering target welding method provided by the present invention comprises the following steps:

[0027] (1) Adjust the welding gap between the main material and the auxiliary material of the sputtering target to 0.1mm;

[0028] (2) Welding with a friction stir welding machine: Insert the rotary cutter on the friction stir welding machine into the welding gap to a depth of 10.6mm, and the rotary cutter rotates for welding. During the rotary welding of the rotary cutter, the auxiliary material rotates with the main material.

[0029] Preferably, the auxiliary sputtering target material is aluminum. The rotation speed of the rotary cutter in the step (2) is 1450 rpm. The speed at which the main material rotates in the step (2) is 120mm / min. The soldering temperature is 644°C.

[0030] Adopting aluminum material to replace the materials in the prior art of auxiliary materials can greatly reduce the cost of raw materials. Compared with any welding metho...

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Abstract

The invention discloses a welding method for a sputtering target material. The welding method for the sputtering target material comprises the following steps: (1) a welding gap between a sputtering target material main material and an auxiliary material is adjusted to be smaller than or equal to 0.3 mm; and (2) a stirring friction welding machine is used to conduct welding; the depth of a rotational cutting tool of the stirring friction welding machine inserted into the welding gap is 10.5-11 mm; welding is conducted rotatably by the rotational cutting tool; and when welding is conducted rotatably by the rotational cutting tool, the auxiliary material rotates with the main material. The welding method for the sputtering target material has the advantages that the cost of raw materials formanufacturing the sputtering target material is saved; moreover, high welding rate is guaranteed; by adopting the welding method, the cost is also lowered when large-scale production is conducted; thus the low-cost sputtering target material can be produced in a large scale; and when the target material is used for manufacturing chips again, the manufacturing cost of the chips is lowered greatly.

Description

technical field [0001] The invention belongs to the technical field of target welding, in particular to a sputtering target welding method. Background technique [0002] The sputtering target refers to the use of an electron gun system to emit and focus electrons on the material to be plated, so that the sputtered atoms follow the principle of momentum conversion and fly away from the material to the substrate to deposit a film with high kinetic energy. The material to be plated is called a sputtering target. The sputtering target is divided into two types: installation and use according to the purpose. It can also be called the auxiliary material for installation and the main material for use. In the prior art, the sputtering target is integrated. Molding requires a large piece of raw material to be made, and the cost of the raw material is extremely high. The high cost makes the sputtering target also pay a high cost when manufacturing chips, which is not conducive to the ...

Claims

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Application Information

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IPC IPC(8): B23K20/12
CPCB23K20/122B23K20/123B23K20/1235
Inventor 大岩一彦姚科科张瑾广田二郎兵藤芳温吕培聪
Owner 宁波顺奥精密机电有限公司
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