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Heat dissipation device for display

A heat dissipation device and display technology, which is applied in the direction of instruments, nonlinear optics, optics, etc., can solve the problems of heat dissipation material defects and application limitations of display heat dissipation devices, and achieve the effect of ultra-thin structure and superior performance

Inactive Publication Date: 2018-12-21
SUZHOU ENBRIGHTECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a display cooling device to solve the problem of limited application due to the defects of the heat dissipation material of the display cooling device in the prior art

Method used

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  • Heat dissipation device for display
  • Heat dissipation device for display
  • Heat dissipation device for display

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Embodiment Construction

[0020] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments.

[0021] Such as figure 1 As shown, the display heat dissipation device of the embodiment of the present invention includes a backplane 101, an adhesive layer 102, a heat dissipation plate 103, a support assembly 402, a reflection sheet 201, a light guide plate 202, a diffusion sheet 203, a display unit 401, and a side-entry LED light source. 301, LED light circuit board 302, LED light strip adhesive layer 303, back plate 101, adhesive layer 102, heat dissipation plate 103, support assembly 402, reflection sheet 201, light guide plate 202, diffusion s...

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Abstract

The invention relates to a heat dissipation device for a display, comprising a backing plate, a bonding layer, a heat dissipation plate, a support component, a reflective sheet, a light guide plate, adiffusion sheet, a display unit, a lateral entrance type LED light source, an LED light circuit board and an LED light bar bonding layer, wherein the backing plate, the bonding layer, the heat dissipation plate, the support component, the reflective sheet, the light guide plate, the diffusion sheet and the display unit are sequentially arranged and are parallel to each other, the lateral entrancetype LED light source, the LED light circuit board and the LED light bar bonding layer are arranged on the side surface of the heat dissipation device and are sequentially arranged, and the lateral entrance type LED light source is arranged at the innermost side. The heat dissipation device for the display has the advantages that the heat dissipation plate uses a high-thermal-conductivity composite for replacing an existing material and is supplemented by good structural design and other heat conduction and heat dissipation materials, thus the obtained heat dissipation device for the displayis ultrathin in structure and superior in performance.

Description

technical field [0001] The invention relates to the field of heat dissipation devices, in particular to a display heat dissipation device. Background technique [0002] With the popularization of liquid crystal display, novel structure and thinner, large-size LCD TVs are gradually emerging. The backlight unit is divided into direct-type backlight and side-type backlight according to the arrangement of LED light sources. For the widely used side-type In terms of backlight, the larger the LCD TV, the higher the power of the light source, and the heat is relatively concentrated. With the development of thinner TVs, higher requirements are put forward for TV heat dissipation. [0003] In the prior art, the application number is 201510043440.X, and the Chinese patent titled "TV cooling device" discloses a TV cooling device with copper as the heat-conducting material. At the same time, a nickel layer is used on the surface to prevent corrosion. Purity is related, and pure copper...

Claims

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Application Information

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IPC IPC(8): G02F1/1333
CPCG02F1/133385
Inventor 雷贝王泽勇程志峰
Owner SUZHOU ENBRIGHTECH
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