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A server and radiator technology, applied in the server field, can solve problems such as difficulty in meeting CPU heat dissipation requirements, affecting normal use of CPU, low heat dissipation efficiency, etc., to achieve the effects of convenient processing, increased noise, and improved heat dissipation efficiency

Active Publication Date: 2021-11-09
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the current case, the heat dissipation efficiency of the CPU is low, and it is difficult to meet the heat dissipation requirements of the CPU, which may affect the normal use of the CPU.

Method used

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Embodiment Construction

[0025] Next, the technical solutions in the embodiments of the present invention will be described in connection with the drawings of the embodiments of the present invention, and it is understood that the described embodiments are merely the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art are in the range of the present invention without making creative labor premise.

[0026] The core of the present invention is to provide a server that enhances heat dissipation efficiency to the CPU.

[0027] A specific embodiment of the server provided by the present invention, please refer to Figure 1 to 3 , Including chassis 3, fan 4, and CPU radiators. The CPU heat sink includes a first heat sink 1 for attaching the CPU to the second heat sink 2 connected to the first heat sink 1 by the thermal heat pipe 5. Among them, the second heat sink 2 is disposed c...

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PUM

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Abstract

The invention discloses a server, which includes a chassis, a fan, and a CPU heat sink, and the CPU heat sink includes a first heat sink for being attached to the CPU and a second heat sink connected to the first heat sink through a heat pipe , the second radiator is arranged close to the fan. In this server, the first heat sink can directly dissipate heat from the CPU, and at the same time, the first heat sink can conduct heat to the second heat sink close to the fan through the solid heat conduction of the heat pipe, and the second heat sink will consume the transferred heat. Reducing the temperature of the CPU can effectively improve the heat dissipation efficiency of the CPU, thereby ensuring the reliable operation of the CPU, especially suitable for models with high CPU power.

Description

Technical field [0001] The present invention relates to the technical field of computer equipment, and in particular, to a server. Background technique [0002] With the development of new technologies such as cloud computing, big data, the data calculation speed and demand requirements are getting higher and higher, the processor's operational speed and computational volume are also increasing, resulting in memory, hard disk and other components. Surprising, especially the power consumption of the CPU is increased in 80%, and the cooling requirements of the CPU are also improved. [0003] However, in the chassis, the cooling efficiency of the CPU is low, it is difficult to meet the demand for cooling of the CPU, which may affect the normal use of the CPU. [0004] Therefore, how to improve heat dissipation efficiency on CPU is a technical problem that will be solved by those skilled in the art. Inventive content [0005] In view of this, it is an object of the present invention...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/183G06F1/20
Inventor 宗斌
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD