A flexible board and an assembly fixture thereof

Abstract

The invention relates to a flexible board and an assembly fixture thereof. The flexible board comprises a flexible board body, A main via region and a standard pad region are arranged on the flexibleboard body, a group of electrical networks correspond to the electrical networks of optical device pins to be fabricated or tested is arranged in the main via region, and a group of standard pads correspond to the electrical networks of the main via are arranged in the standard pad region. The flexible board body further comprises a test pad region, wherein the test pad region is arranged betweenthe main via region and the standard pad region; A set of test pads corresponding to the standard pad electrical network is provided in the test pad area. The invention has the beneficial effects that: by increasing the butt joint tolerance between the circuit board pad and the test pad, when the flexible soft board is tested, the bad butt joint between the flexible soft board body and the circuitboard pad is not easy to occur or even misaligned press fit, thereby improving the reliability and the yield of the optical device in the test process.

Description

technical field [0001] The invention relates to the technical field of optical communication, in particular to a flexible soft board and an assembly fixture thereof. Background technique [0002] At present, in the manufacturing process of rigid printed circuit board (Printed Circuit board, PCB), flexible circuit board (FlexiblePrinted Circuit, FPC) or soft and hard board, it is necessary to carry out circuit layout design and components (such as resistors, capacitors, integrated circuit, etc.) layout design, and then perform circuit wiring according to a preset path and form a pad at a preset position. In the case of limited space and volume, and with the development trend of high integration of optoelectronic devices and communication modules, the size specified by industry standards is getting smaller and smaller. The size of the flexible soft board is also getting smaller and smaller, and the pads are becoming more and more dense; in this way, in the process of manufact...

AI Technical Summary

Problems solved by technology

And because the flexibility of multi-layer boards is much lower than that of single-layer boards, in the multi-process production and testing of optoelectronic devices and modules, repeated positioning and assembly will cause damage to flexible soft boards, which not only affects the appearance, but also affects performance, resulting in the use of The products of the flexible soft board must be replaced with a new flexible soft board at high temperature before being sold. During the high temperature replacement process, it is easy to cause damage to the product again and cause it to fail.

Due to the above defects in the flexible soft board with high-density pads and its press-fitting method, the optoelectronic devices and communication modules are damaged or failed during the manufacturing and testing process, and the defect rate increases

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