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Temperature controlling device and system having static cooling capacity

A static and coolant technology, applied in the cooling of instruments, components of instruments, lighting and heating equipment, etc., can solve the problem of not being able to provide cooling

Active Publication Date: 2018-12-21
CLEAR PX TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, current cooling systems cannot provide effective cooling for handling harsh environments such as large data centers

Method used

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  • Temperature controlling device and system having static cooling capacity
  • Temperature controlling device and system having static cooling capacity
  • Temperature controlling device and system having static cooling capacity

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Embodiment Construction

[0042] The present invention provides a cooling device and system for efficiently cooling heat generating bodies such as electronic circuits or electronic components or data centers. The present invention provides a high-efficiency cooling system that can be configured such that the cooling system does not require maintenance as a critical system while providing high-efficiency cooling performance even during cooling system shutdowns.

[0043] The present invention relates to a cooling device, and more particularly to such devices and systems for cooling heat generating loads, more preferably electronic circuits and / or electronic components, by providing a device housing capable of providing a A large volume of coolant, the liquid is suitable for absorbing the large amount of heat generated by the load.

[0044] Specifically, embodiments of the present invention provide a cooling device capable of demonstrating both dynamic cooling and static cooling. Dynamic cooling is provi...

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Abstract

A cooling device for cooling a heat generating load, the device having an enclosed housing defining a continuous cooling volume for flowing a coolant between an inlet and an outlet. The housing featuring at least one surface that is configured for facilitating heat exchange sequence with the heat generating load such that the coolant is configured to absorb generated heat.

Description

[0001] Cross References to Related Applications [0002] This application is a non-provisional application and claims priority to U.S. Provisional Patent Application No. 62 / 316,048, entitled "System and Apparatus for Removing Waste Heat Generated by Computer Components and Improving Performance," filed March 31, 2016 Right, the contents of this U.S. Provisional Patent Application are incorporated herein by reference as if fully set forth herein. technical field [0003] The present invention relates to a cooling device, a system for cooling a heat generating load, and more particularly to such a device, system and method for effectively cooling electronic components using a cooling liquid. Background technique [0004] It has been proposed to use cooling liquids to cool small and large electronic components, for example in the form of data centers. However, the use of cooling by circulation of piped water and / or air is limited because it is not sufficient to cool the large ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28F7/00F28F13/00F28F21/00F28F23/00G06F1/20G12B15/04H01L23/40H01L23/42H01L23/473
CPCG06F1/20H05K7/20781F28F3/12F28D2021/0029F28F2013/008F28F2200/00F28F2260/00F28F23/02H05K7/20836
Inventor 海姆·德罗尔阿泰·齐夫拉巴赫·克霍里可赛·奥马瑞
Owner CLEAR PX TECH LTD