Flexible LED device and manufacturing method thereof, LED filament

A technology of LED devices and manufacturing methods, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems that welding points of electrodes are prone to open welding, deadness, etc. Improved stability and reliability effects

Pending Publication Date: 2018-12-25
FOSHAN NATIONSTAR SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, when the flexible LED filament is bent, the welding po

Method used

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  • Flexible LED device and manufacturing method thereof, LED filament
  • Flexible LED device and manufacturing method thereof, LED filament
  • Flexible LED device and manufacturing method thereof, LED filament

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Embodiment Construction

[0038] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0039] see figure 1 , figure 1 It is a production flow chart of a flexible LED device of the present invention, and a production method of a flexible LED device provided by the present invention includes the following steps:

[0040] S101, providing a flexible substrate.

[0041] The flexible substrate of the present invention is made of flexible materials, and as the base of the LED chip, it can be bent into any shape.

[0042] Preferably, the flexible substrate is made of polymethyl methacrylate, polyimide and polytetrafluoroethylene. In other embodiments of the present invention, the flexible substrate can also be a flexible substrate made of acrylic material, polyimide material, PI material, FR-4, CEM-3, CEM-1 or polytetrachloroethylene material.

[0043] ...

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PUM

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Abstract

The invention discloses a manufacturing method of a flexible LED device, comprising the following steps: providing a flexible substrate; applying insulating glue on the flexible substrate and adheringa springback material on the flexible substrate to form a springback layer; making a circuit on the elastic layer to form a circuit layer; bonding the electrode of the LED chip on the circuit layer,wherein the LED chip and the circuit layer form an electrically conductive connection. As the solder point between the LED chip electrode and the solder paste layer of the invention is buffered by thespringback layer, the solder point is not liable to break, so that the LED chip is fixed on the flexible substrate, the stability and reliability of the LED device are further improved, and the LED device has more flexible performance and bending performance. Accordingly, the invention also provides a flexible LED device and an LED filament.

Description

technical field [0001] The invention relates to the technical field of light emitting diodes, in particular to a flexible LED device, a manufacturing method thereof, and an LED filament. Background technique [0002] As the most promising new-generation light source, LED has been widely used in the market due to its advantages of small size, long life, high luminous efficiency, energy saving and environmental protection. At the same time, with the implementation of the national "white ban", LED light sources have been vigorously promoted by the country, and their energy-saving advantages have also been recognized by the majority of families. Based on people's inherent feelings and aesthetic design needs for incandescent lamps that have been used for more than 130 years, LED filament lamps have been widely favored because of their appearance similar to incandescent lamps. The appearance characteristics of LED filament lamps meet the needs of differentiated and antique lamps ...

Claims

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Application Information

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IPC IPC(8): H01L33/62
CPCH01L33/62H01L2933/0066
Inventor 仇美懿
Owner FOSHAN NATIONSTAR SEMICON
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