A lead frame tape cutting mechanism
A lead frame and tape cutting technology, which is applied in the manufacture of electrical components, circuits, semiconductor/solid-state devices, etc., can solve the problems of semiconductor device vibration and drop, unfavorable semiconductor device collection, etc., to prevent bending deformation, orderly placement and stable effect
Active Publication Date: 2021-08-27
泸州龙芯微科技有限公司
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Problems solved by technology
[0003] At present, the cutting method of the lead frame tape is mostly manually holding the lead frame tape under the cutting knife, and then moving the cutting knife down to cut the lead frame tape. Since the volume of the semiconductor device is relatively small and the weight is relatively light, the cutting knife When cutting semiconductor devices, the vibration generated by the cutting knife falling and cutting will easily shake the semiconductor devices off the rack, which is not conducive to the collection of cut semiconductor devices
Method used
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[0020] The following is further described in detail through specific implementation methods:
[0021] The reference signs in the accompanying drawings of the specification include: feeding cylinder 1, push rod 2, push block 3, extension spring 4, connecting frame 5, discharging cylinder 6, discharging rod 7, cylinder 8, second gear 9, tooth Bar 10, collection box 12, turntable 13, connecting rod 14, slide bar 15, leading screw 16, moving block 17, clamping sleeve 18, pull open bar 19, riser 20, first gear 21, pull open sheet 22, Heat cutter 23, cylinder rod 24, semiconductor device 25, lead frame band 26.
[0022] The embodiment is basically as attached Figure 1-Figure 6 Shown: a lead frame tape cutting mechanism, including a frame, the frame is provided with a horizontally arranged feeding cylinder 1, and the right end of the feeding cylinder 1 is connected with a discharge cylinder 6 perpendicular to the feeding cylinder 1 and arranged horizontally , the left end of the f...
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The present invention relates to the field of semiconductor processing, in particular to a lead frame strip cutting mechanism, which includes a frame, on which is provided a horizontally arranged feeding barrel, and one end of the feeding barrel is connected with an outlet vertically and transversely arranged to the feeding barrel. Barrel, the other end of the feed barrel is slidingly connected with a push rod, one end of the push rod is located in the feed barrel, the other end of the push rod is located outside the feed barrel, and the push rod is located between the end outside the feed barrel and the discharge barrel There are tension springs connected between them, jacks are provided at the bottom and top of the feeding barrel, the jacks at the top of the feeding barrel and the jacks at the bottom of the feeding barrel are arranged alternately; there are stripping units above and below the feeding barrel , the frame is slidably connected with a hot cutter opposite to the jack, one end of the discharge cylinder is slidably connected with a discharge rod, one end of the discharge rod is located in the discharge cylinder, and the other end of the discharge rod is located outside the discharge cylinder, The other end of the discharge cylinder is provided with a collection box. This solution prevents the semiconductor device from vibrating off the frame when the semiconductor device is cut.
Description
technical field [0001] The invention relates to the field of semiconductor processing, in particular to a lead frame strip cutting mechanism. Background technique [0002] A semiconductor refers to a material whose conductivity at room temperature is between that of a conductor and an insulator. Semiconductors have a wide range of applications in radios, televisions, and temperature measurement. Semiconductors are usually processed in large quantities during the processing process. After processing, the packaged products are cut through the rib cutting process, and the dams between the outer pins of the lead frame and the joints of the lead frame strips are cut off. [0003] At present, the cutting method of the lead frame tape is mostly manually holding the lead frame tape under the cutting knife, and then moving the cutting knife down to cut the lead frame tape. Since the volume of the semiconductor device is relatively small and the weight is relatively light, the cuttin...
Claims
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IPC IPC(8): H01L21/67
CPCH01L21/67092
Inventor 黄晓波
Owner 泸州龙芯微科技有限公司