Rapid-conduction indirect liquid cooling heat radiation structure combining with micro-channel

Abstract

The invention provides a rapid-conduction indirect liquid cooling heat radiation structure combining with a micro-channel, and the structure comprises a liquid cooling cold plate with a snakelike liquid cooling channel inside, a thermal conduction film and a heat radiation copper block, wherein the thermal conduction film and the heat radiation copper block are sequentially disposed at the bottomof the liquid cooling cold plate in a manner of being corresponding to the position of a big power consumption device. The flowing direction of the snakelike liquid cooling channel correspondingly passes through a space above the position of the big power consumption device, and the interior of the snakelike liquid cooling channel is provided with micro-channel heat radiation teeth corresponding to the big power consumption device. The interior of a snakelike channel indirect liquid cooling cold plate is combined with the micro-channel heat radiation teeth, and a conduction heat radiation copper block structure is embedded, thereby improving the thermal conduction efficiency from a chip device to the liquid cooling cold plate and the heat exchange performance of the liquid cooling cold plate, solving the problems that the limited heat exchange area of a conventional snakelike channel liquid cooling cold plate causes the insufficient heat radiation and the thermal conduction efficiencyfrom a chip to a cold plate is not high, and overall improving the heat radiation efficiency of a reinforced printed board card.

Description

technical field [0001] The invention relates to the field of reinforced printed boards under high power consumption environments, in particular to a rapid conduction indirect liquid cooling and heat dissipation structure combined with micro-channels. Background technique [0002] With the rapid development of electronic technology, the total power density of electronic components has increased significantly while the physical size has become smaller and smaller, and the high temperature environment will affect the performance of electronic components. Effectively solving the heat dissipation problem of electronic components has become a key technology in the manufacture of electronic components and electronic equipment. Liquid cooling technology can meet the heat dissipation requirements of high heat flux to a certain extent. [0003] Liquid cooling usually refers to pumping the heat generated by the heating element through the circulating liquid to another heat exchange env...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the problems existing in the prior art, the present invention provides a rapid conduction indirect liquid cooling heat dissipation structure combined with micro-channels, combining micro-channel heat dissipation teeth in the serpentine channel indirect liquid cooling cold plate, and embedding conduction heat dissipation copper at the same time block structure, thereby improving the heat conduction efficiency from the chip device to the liquid-co

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