Radio frequency DIP package socket and IC device testing system and method
A socket and radio frequency technology, applied in the direction of electronic circuit testing, instruments, measuring electricity, etc., can solve the problems of low efficiency of radio frequency IC products, and achieve the effect of improving test efficiency, light weight and solderability
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Embodiment 1
[0064] Such as figure 1A radio frequency DIP package socket 100 shown includes: a metal shell 10 , an insulating medium 20 and inner conductor pins 30 . in,
[0065] A plurality of through holes (not shown) are respectively provided on the first surface 11 and the second surface 12 of the metal shell 10 . Wherein, the first surface 11 and the second surface 12 are two opposite surfaces of the metal shell, and the through holes on the two opposite surfaces correspond to each other. There are multiple inner conductor pins 30, which are respectively inserted in the multiple through holes on the first surface 11 of the metal shell 10, and protrude from the multiple through holes on the second surface 12 of the metal shell 10 to form a protruding portion. 31. The metal shell 10 is filled with an insulating medium 20 , and the insulating medium 20 wraps the inner conductor pin 30 .
[0066] Specifically, in this embodiment, the metal casing 10 has a cuboid structure, for example...
Embodiment 2
[0073] Such as image 3 A test board 200 shown includes: a PCB board 40 , a test plug 50 and the radio frequency DIP package socket 100 in Embodiment 1. in,
[0074] The radio frequency DIP package socket 100 is fixed on the PCB 40 through the protruding part 31 of the inner conductor pin 30 , and the position on the PCB 40 where the radio frequency DIP package socket 100 is fixed has no solder mask.
[0075] The inner conductor pin 30 in the signal hole of the radio frequency DIP package socket 100 is drawn out from the PCB board 40 as a signal input terminal and a signal output terminal, and then the test plug 50 is welded.
[0076] Specifically, in this embodiment, the radio frequency DIP package socket 100 can be plugged or welded on the PCB 40 through the protruding portion 31 of the inner conductor pin 30 . Soldering the RF DIP package socket on the PCB board where there is no solder mask can ensure that the bottom of the RF DIP package is fully grounded.
[0077] A k...
Embodiment 3
[0079] Such as Figure 4 The shown IC device testing system 300 includes: a tester 60 and the test board 200 in the second embodiment. in,
[0080] The IC device 70 to be tested is plugged into the RF DIP package socket 100 of the test board 200 .
[0081] The test plug 50 of the test board 200 is connected to the tester 60 for performance testing of the IC device 70 to be tested.
[0082] Specifically, in this embodiment, the test plug 50 and the tester 60 can be connected through the connection cable 52 and the cable plug 51, and the connection mode between the test plug 50 and the cable plug 51 can be a plug-in connection, but this Embodiments of the invention are not limited thereto.
[0083] A kind of IC device testing system provided in the above-mentioned embodiment, by plugging the IC device to be tested on the radio frequency DIP package socket of the test board, the test plug of the test board is connected with the tester, the performance test of the IC device can...
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