A straight down backlight source structure applied to mini and micro backlight and a manufacturing method thereof

Abstract

The invention relates to a straight down backlight source structure applied to mini and micro backlight and a preparation method thereof, the structure comprises a PCB board, an LED chip in a WLP package form, a first fluorescent powder layer, and a plurality of LED chips in a WLP package form arranged on the PCB board, wherein the LED chip in the WLP package form comprises an LED chip body and asingle-concentration fluorescent powder layer covering the top surface of the chip body; the PCB board is provided with a first phosphor layer covering an LED chip in a WLP package form, wherein the height of the first phosphor layer is higher than the height of the LED chip in the WLP package form, the phosphor concentration of the first phosphor layer is recorded as W1, and the refractive indexof the first phosphor layer is recorded as N1; A light mix layer is arrange on that first fluorescent powder layer, and the fluorescent powder concentration of the light mix layer is recorded as W2, and W2 < W1; The refractive index of the light mixing layer is denoted by N2, and N2 < N1. The invention has the advantages of ensuring accurate positioning when the LED chip is mounted on the PCB, realizing a better light mixing effect, and reducing the thickness of the light mixing layer while achieving the same light mixing effect.

Description

technical field [0001] The invention relates to a direct-type backlight structure applied to mini and micro backlights, and also relates to a method for manufacturing the direct-type backlight. Background technique [0002] Light-emitting diodes (LEDs) have the advantages of small size, long service life, energy saving, environmental protection, fast response, and durability. They are widely used in automotive and indoor lighting, traffic lights, screen displays, and LCD backlights. They are ideal for replacing traditional light sources. light source. The packaging structure of light-emitting diodes usually includes phosphors. The phosphor powder is usually mixed in the encapsulant to change the color of the light emitted by the LED. [0003] Chip-scale packaged LED chips are widely used in the field of backlights due to their advantages of no substrate, no bonding wires, small size, thin thickness, high power load capacity, and strong size design flexibility. At this sta...

AI Technical Summary

Problems solved by technology

[0007] (1) Positioning problem; when the LED lamp bead is made, because the LED chip is wrapped with a layer of phosphor layer, when cutting, the thickness of the phosphor layer on the left and right sides of the LED chip is inconsistent, so that the LED chip is not in the center of the phosphor layer , so that the accuracy of the arrangement of LED lamp beads cannot be controlled

[0008] (2) Concentration difference and refraction. In addition, if a better light mixing effect needs to be achieved, the thickness is thicker, which is not conducive to further reducing the thickness of the direct-type backlight module

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