A high-precision automatic fpc binding device

A high-precision, automatic technology, used in instruments, nonlinear optics, optics, etc., can solve problems such as increased scratch damage, unguaranteed alignment accuracy, and increased product defect rate.
CN109188736BActive Publication Date: 2021-04-27浙江鼎晶科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
浙江鼎晶科技有限公司
Publication Date
2021-04-27

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Abstract

The invention provides a high-precision automatic FPC binding device, which includes an upper frame, a lower frame and a UPS uninterruptible power supply, and is characterized in that: it also includes an ACF attachment mechanism, an FPC pre-pressing mechanism, an FPC local pressure mechanism, an FPC upper The material platform mechanism and the four-axis adjustment conveying platform mechanism; the FPC main pressing mechanism, the FPC pre-pressing mechanism and the ACF attachment mechanism are sequentially arranged on the horizontal workbench of the lower frame, and the FPC feeding platform mechanism is connected with the ACF attachment mechanism. The four-axis adjustment conveying platform mechanism is arranged on the horizontal workbench of the lower frame and is located at the front side of the FPC local pressing mechanism, the FPC pre-pressing mechanism and the ACF attaching mechanism. The invention is equipped with an adjustable four-axis transport platform to transport the liquid crystal glass substrate, corrects and compensates through CCD alignment, reduces the error of FPC binding, and only needs one operator to load and unload materials at the same station to complete the entire binding process , greatly reducing the uncertainty caused by manual operation, and greatly improving the binding accuracy of the product.
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Description

technical field

[0001] The invention relates to the field of LCM liquid crystal module production equipment, in particular to a high-precision automatic FPC binding equipment. Background technique

[0002] In the LCM liquid crystal module production process, the FPC binding process involves ACF attachment, FPC loading, FPC and liquid crystal glass substrate alignment pre-pressing, and FPC local pressure curing.

[0003] Among the existing semi-automatic equipment, the FPC binding process is divided into two equipment to complete, one for ACF attachment, and one for FPC pre-pressing and local pressing, so at least two operators are required to complete the entire binding In addition, it is necessary to manually transfer the attached product to another device, which increases the risk of scratching and damage to the product during the manufacturing process, and virtually increases the cost. At the same time, the two devices need to be manually aligned separately, and there is...

Claims

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