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Multifunctional vacuum evaporation ultrathin film device

An ultra-thin, multi-functional technology, applied in the field of multi-functional vacuum evaporation ultra-thin film devices, can solve the problems of difficult to achieve controllable evaporation of sub-nano-scale thin films, and achieve the effect of reducing influence and heat loss.

Pending Publication Date: 2019-01-15
LANZHOU UNIVERSITY
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The existing resistance heating evaporation coating method is generally aimed at semiconductor, electronic device coating or optical coating. The thickness of the film layer is generally on the order of hundreds of nanometers, and it is difficult to achieve controllable evaporation of sub-nanometer films.

Method used

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  • Multifunctional vacuum evaporation ultrathin film device

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Embodiment Construction

[0032] like figure 1 As shown, the present invention discloses a multifunctional vacuum evaporation ultra-thin film device, comprising a high temperature evaporation module or a low temperature evaporation module d2, a casing d1, a water cooling platform c1, a water diversion pipeline c2, a through lead c3, a baffle c4, a vacuum sealing The movable connection c5 and the support rod c12, the high temperature evaporation module or the low temperature evaporation module d2 are installed on the water cooling platform c1 and placed inside the casing d1. The water cooling platform c1 is connected with the water diversion pipeline c2 and the support rod c12, and is fixed on the vacuum sealing movable connection c5 through the support rod c12. The water diversion pipe c2, the through lead c3 and the baffle c4 pass through the vacuum seal movable connection c5 to realize the communication between the cooling water, the electric wire and the mechanical rotating rod inside and outside th...

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Abstract

The invention discloses a multifunctional vacuum evaporation ultrathin film device. The multifunctional vacuum evaporation ultrathin film device comprises a high-temperature evaporation module or a low-temperature evaporation module and a movable water-cooling module, wherein the high-temperature evaporation module or the low-temperature evaporation module uses respective methods to evaporate a coating material to the surface of a sample to be evaporated to form a thin film in a vacuum environment, and the movable water-cooling module is used for supporting the movement, testing and cooling ofthe high-temperature evaporation module and the low-temperature evaporation module in vacuum. According to the multifunctional vacuum evaporation ultrathin film device, integration on a same platformis realized through the size design of the high-temperature and low-temperature evaporation modules. The evaporation modules are all provided with heat radiation shielding layers so that heat loss and unstable factors caused by external disturbances can be effectively reduced. Furthermore, controllable evaporation of a minute quantity of film materials can be carried out on the surface to realizethe evaporation of ultrathin films of angstrom magnitude. Shielding layers are arranged between heating wires and a base in the high-temperature evaporation module to reduce the influence of evaporation molecules on the base.

Description

technical field [0001] The invention belongs to the technical field of vacuum thermal evaporation coating, and particularly relates to a multifunctional vacuum evaporation ultra-thin film device that can controllably evaporate single atom / molecular layer films to samples in vacuum by using different temperature evaporation sources on the same platform. Background technique [0002] At present, the existing vacuum thermal evaporation coating technology is basically aimed at the field of semiconductor, electronic device coating or optical coating production and manufacturing. Evaporation is commonly accomplished by resistively heating the coating material to vaporize or sublime and condense on the surface of the sample. [0003] The existing resistance heating evaporation coating methods are generally aimed at semiconductor, electronic device coating or optical coating, and the film thickness is generally in the order of 100 nanometers, and it is difficult to achieve controlla...

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Application Information

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IPC IPC(8): C23C14/26C23C14/56
CPCC23C14/243C23C14/26C23C14/56
Inventor 陈林张鑫刘玥峰郭艳玲陈熙萌
Owner LANZHOU UNIVERSITY