A kind of preparation method and application of flexible device

Abstract

The invention provides a preparation method and application of a flexible device. The preparation method comprises the following steps: (1) setting a sacrificial layer on a transparent substrate, and setting a flexible device on the sacrificial layer; The peeling realizes the separation of the sacrificial layer and the flexible device to obtain the flexible device; wherein, the preparation raw materials of the sacrificial layer include a matrix resin and a photosensitive additive. The present invention adopts matrix resin and photosensitizing auxiliary agent as the preparation raw materials of the sacrificial layer, and the photosensitive auxiliary agent has photosensitive groups, and the photosensitive group can absorb light energy to destroy the structure of the matrix resin, thereby causing the sacrificial layer to lose cohesiveness, and finally The flexible device is separated from the sacrificial layer without stress at room temperature, so that adverse effects such as slight deformation of the flexible device during the peeling process can be avoided.

Description

technical field [0001] The invention belongs to the technical field of flexible devices, and relates to a preparation method and application of a flexible device. Background technique [0002] With the development of technology, flexible devices have gained more and more attention and applications in recent years. In the preparation process of flexible devices, in order to ensure the precise alignment and flatness of each film layer, a support substrate with certain mechanical strength and flatness is usually required. A sacrificial layer is prepared on the support substrate, and then the flexible substrate is placed on the sacrificial substrate. layer, and then form each film layer of the flexible device on the flexible substrate to form a flexible device, and finally peel off the flexible device from the sacrificial layer and the supporting substrate, and finally laminate a protective film on the flexible substrate to obtain a flexible device. During the peeling process o...

AI Technical Summary

Problems solved by technology

CN105489789A discloses a method for preparing a flexible device and a flexible display device, including preparing an organosiloxane layer on a support substrate, preparing a flexible substrate on the organosiloxane layer, and preparing a display device on the flexible substrate. The silicon dioxide layer is obtained by oxidizing the contact surface of the alkane layer and the supporting substrate, and the supporting substrate is peeled off from the silicon dioxide layer to obtain a flexible device. Although this method reduces the risk of damage to the flexible device, it has Some silica layers are more difficult to peel off, which greatly affects its application

[0005] In the current prior art, polyimide is generally used as the flexible substrate of flexible devices, and there is no report of using polyimide as a sacrificial layer in the preparation method of flexible devices. CN106687541A provides a polyimide Used as a laser lift-off material for 3D IC applications, a preferred lift-off layer is formed from a composition comprising polyamic acid or polyimide dissolved or dispersed in a solvent system, the polyimide lift-off layer in this method is passed through a laser The debonding technology achieves peeling, but it uses the thermal decomposition of the resin to achieve the separation effect. If it is applied to the preparation of ultra-thin flexible devices, it is easy to damage the flexible devices.