A method for automatically extracting plane patches from 3D laser point cloud data of foundation
A 3D laser and planar slice technology, applied in the field of computer vision, can solve problems such as difficult to process multiple planar slices in parallel, difficult to deal with uneven density distribution, insufficient robustness of seed points, etc., and achieve fast calculation speed and high accuracy , the effect of easy parallelization
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[0043] The present invention will be further described below in conjunction with the embodiments and accompanying drawings, but the protection scope of the present invention should not be limited thereby.
[0044] The method of the present invention for automatically extracting plane slices from the ground-based three-dimensional laser point cloud data is a method of combining the parameter domain and the space domain, that is, selecting seed points in the parameter domain, and then using these seed points to perform region growth in the space domain , so as to automatically extract each planar slice. The main steps include: (1) data down-sampling (sub-sample); (2) point attribute (normal vector) calculation and quantification; (3) parameter domain clustering to select seed points, and space domain growth segmentation plane slice; (4) ) least square plane parameter estimation and patch boundary calculation.
[0045] see figure 1 , figure 1 It is a process block diagram of t...
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