Unlock instant, AI-driven research and patent intelligence for your innovation.

A wafer-level lens module

A lens module and wafer-level technology, applied in radiation control devices, TVs, color TVs, etc., can solve problems such as poor imaging quality, low anti-electromagnetic interference ability, and inability to obtain clear images, and achieve broad and effective absorption frequency band, good optical performance, and the effect of preventing electromagnetic wave interference

Active Publication Date: 2021-01-29
小巧精密科技(南通)有限公司
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The lens holder and lens barrel of the existing lens module are mainly made of PC, ABS or PTFE plastics, which have low anti-electromagnetic interference ability, so the lens module components are easily affected by external electromagnetic wave interference and generate noise, and electromagnetic wave interference will cause image quality. Poor, clear images cannot be obtained. When the imaging resolution is high, the impact of external electromagnetic waves on the image quality caused by the interference of the lens module components is more obvious

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A wafer-level lens module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] In this embodiment, a wafer-level lens module includes a wafer layer, a charge-coupled component image sensor, a lens group, a spacer component, an anti-reflection filter layer, a light-shielding layer, and an electromagnetic shielding layer. The charge-coupled component image sensor The sensor is manufactured on the wafer layer by a wafer-level optical process. The spacer is set on the image sensor of the charge-coupled device. The lens group is made of multiple lenses, and the edge of the lens group is coated with an anti-reflection filter. The light-shielding layer is coated with a light-shielding layer on the anti-reflection filter layer, and the light-shielding layer is chromium nitride, and an electromagnetic shielding layer is coated on the light-shielding layer, and the electromagnetic shielding layer is obtained by coating and drying an electromagnetic shielding paint. The preparation of electromagnetic shielding coating comprises the following steps:

[0034] ...

Embodiment 2

[0040] In this embodiment, a wafer-level lens module includes a wafer layer, a charge-coupled component image sensor, a lens group, a spacer component, an anti-reflection filter layer, a light-shielding layer, and an electromagnetic shielding layer. The charge-coupled component image sensor The sensor is manufactured on the wafer layer by a wafer-level optical process. The spacer is set on the image sensor of the charge-coupled device. The lens group is made of multiple lenses, and the edge of the lens group is coated with an anti-reflection filter. The light-shielding layer is coated with a light-shielding layer on the anti-reflection filter layer, and the light-shielding layer is chromium nitride, and an electromagnetic shielding layer is coated on the light-shielding layer, and the electromagnetic shielding layer is obtained by coating and drying an electromagnetic shielding paint. The preparation of electromagnetic shielding coating comprises the following steps:

[0041] ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a wafer-level lens module, including a wafer layer, a charge-coupled component image sensor, a lens group, a spacer component, an anti-reflection filter layer, a light-shielding layer, and an electromagnetic shielding layer. The charge-coupled component image sensor consists of The wafer-level optical process is produced on the wafer layer, the spacer is set on the image sensor of the charge-coupled device, the lens group is made of multiple lenses, and the edge of the lens group is coated with an anti-reflection filter layer A light-shielding layer is coated on the anti-reflection filter layer, the light-shielding layer is chromium nitride, and an electromagnetic shielding layer is coated on the light-shielding layer. The lens module has good optical performance and anti-interference performance of external electromagnetic waves.

Description

technical field [0001] The invention relates to the field of lens modules, in particular to a wafer-level lens module. Background technique [0002] The lens holder and lens barrel of the existing lens module are mainly made of PC, ABS or PTFE plastics, which have low anti-electromagnetic interference ability, so the lens module components are easily affected by external electromagnetic wave interference and generate noise, and electromagnetic wave interference will cause image quality. Poor, clear images cannot be obtained. When the imaging resolution is high, the impact of external electromagnetic waves on the imaging quality caused by the interference of the lens module components is more obvious. Contents of the invention [0003] The present invention aims to provide a wafer-level lens module to solve the above-mentioned problems. [0004] An embodiment of the present invention provides a wafer-level lens module, including a wafer layer, a charge-coupled component im...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H04N5/225H01L27/148
CPCH01L27/14806H01L27/14818H04N23/54H04N23/55
Inventor 甘坚梅
Owner 小巧精密科技(南通)有限公司