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Wafer transfer module and method for transferring wafers

A wafer, extension direction technology, applied in the direction of instruments, measuring force, measuring devices, etc., can solve problems such as not fully satisfied

Active Publication Date: 2021-10-26
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Although the existing wafer transfer technology and equipment are sufficient to meet their needs, they are still not fully satisfied.

Method used

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  • Wafer transfer module and method for transferring wafers
  • Wafer transfer module and method for transferring wafers
  • Wafer transfer module and method for transferring wafers

Examples

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Embodiment Construction

[0074] The following disclosure provides many different embodiments or examples for implementing various features of the invention and the following disclosure of this specification is a specific example describing various components and arrangements in order to simplify the description of the invention. Of course, these specific examples are not intended to limit the embodiments of the present invention. For example, if the following disclosure of this specification describes the formation of a first feature on or over a second feature, it includes embodiments in which the first feature and the second feature are formed in direct contact with each other. , and also includes embodiments in which additional features may be formed between the first and second features, so that the first and second features may not be in direct contact. In addition, repeated reference symbols and / or words may be used in different examples in the description of the embodiments of the present inven...

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Abstract

Embodiments of the present disclosure provide a wafer transfer module and a wafer transfer method. The wafer transfer module includes a drive assembly. The wafer transfer module also includes a carrier. The carrier is disposed on the drive assembly and includes an extension. The extension part extends from a first end to a second end along an extension direction and includes a first segment, a second segment and a third segment in sequence. The first section and the second section are configured to carry the wafer, and the distance between the boundary of the second section and the third section and the first end is greater than the width of the wafer. The wafer transfer module also includes a tip pressure sensor. The end pressure sensor is disposed on the third section of the slide and is configured to sense a pressure and send out an electronic signal according to the sensed pressure. The embodiments of the present disclosure can avoid problems such as wafer dropping, wafer scratching, or collision with a shifted wafer transfer module, so as to effectively improve the yield rate of wafer manufacturing.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of semiconductor manufacturing, and in particular, to a wafer transfer module for transferring semiconductor wafers and a method for transferring semiconductor wafers. Background technique [0002] Semiconductor devices are used in a variety of electronic applications, such as personal computers, mobile phones, digital cameras, and other electronic equipment. Semiconductor devices are usually fabricated by sequentially depositing insulating or dielectric layer materials, conductive layer materials, and semiconductor layer materials on a semiconductor substrate, and patterning various material layers through procedures including lithography and lithography. to form circuit components and parts on the semiconductor substrate. Typically dozens or hundreds of integrated circuits are fabricated on a single semiconductor wafer. [0003] In the integrated circuit manufacturing process, with ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/677G01L1/00
CPCG01L1/00H01L21/677H01L21/67703H01L21/67763
Inventor 王林伟任勇彰陈政廷张正峰
Owner TAIWAN SEMICON MFG CO LTD