Wafer vertical stability calibration system and method for calibrating vertical stability of wafer

A calibration system and stability technology, applied in the direction of conveyor objects, electrical components, semiconductor/solid-state device manufacturing, etc., can solve problems such as difficult adjustment, aging of wafer devices, misalignment of position and wafer position, etc., to ensure Precise grasping, avoiding position changes, improving yield and output

Active Publication Date: 2019-01-29
SEMICON MFG INT (SHANGHAI) CORP +1
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Problems solved by technology

[0003] 1) The aging or wear of the wafer device supporting the acid-base cleaning causes position deviation, and the wafer cannot stand completely vertically in the support device. When the gripper is grasped, the position of the gripper and the position of the wafer cannot be aligned. Cause problems such as falling pieces, fragments, scratches, etc.;
[0004] 2) The cleanin

Method used

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  • Wafer vertical stability calibration system and method for calibrating vertical stability of wafer
  • Wafer vertical stability calibration system and method for calibrating vertical stability of wafer
  • Wafer vertical stability calibration system and method for calibrating vertical stability of wafer

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[0061] In the following description, numerous specific details are given in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without one or more of these details. In other examples, some technical features known in the art are not described in order to avoid confusion with the present invention.

[0062] It should be understood that the invention can be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. Like reference numerals refer to like elements throughout.

[0063] It will be understood that when an element or layer is referred t...

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Abstract

The invention provides a wafer vertical stability calibration system and a method for calibrating the vertical stability of a wafer. The system comprises a wafer to be calibrated, a supporting device,a dynamic balance system and a grabbing device, wherein supporting device is used for placing the wafer to be calibrated; the dynamic balance system is arranged at two sides of the wafer to be calibrated and opposite to the surface of the wafer to be calibrated, the dynamic balance system includes a plurality of nozzles which are different in position, the nozzles can spray a liquid or gas to thesurface of the wafer to be calibrated so as to calibrate the position of the wafer to be calibrated and enable the wafer to be calibrated to keep a vertical state; and the grabbing device is used forgrabbing the wafer to be calibrated to move from one position to another position. The system provided by the invention avoids the problems such as wafer dropping, breaking and scratching due to thechange in position when a transmission gripper grabs the wafer, and improves the yield and output.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a wafer vertical stability calibration system and a method for calibrating the wafer vertical stability. Background technique [0002] Usually, the chemical mechanical polishing (CMP) machine is divided into two parts: grinding part and wafer cleaning. steps, these steps are to take the wafer from one location to another through the gripper claws above the cleaning device. This requires that each position of the wafer be aligned with the position of the gripper to ensure that the gripper can accurately and safely grasp the wafer from one position to another. The position of the grasping is relatively strict. Once the position of each cleaning step deviates, the gripper will fail to grasp the wafer, or scratches and fragments will occur. There are various reasons for the position deviation of each cleaning step. The main reasons are: [0003] 1) The aging or wear of the...

Claims

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Application Information

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IPC IPC(8): H01L21/683H01L21/68H01L21/677
CPCH01L21/677H01L21/68H01L21/683
Inventor 夏连山张连伯汪志宇唐强
Owner SEMICON MFG INT (SHANGHAI) CORP
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