Wafer vertical stability calibration system and method for calibrating vertical stability of wafer

Abstract

The invention provides a wafer vertical stability calibration system and a method for calibrating the vertical stability of a wafer. The system comprises a wafer to be calibrated, a supporting device,a dynamic balance system and a grabbing device, wherein supporting device is used for placing the wafer to be calibrated; the dynamic balance system is arranged at two sides of the wafer to be calibrated and opposite to the surface of the wafer to be calibrated, the dynamic balance system includes a plurality of nozzles which are different in position, the nozzles can spray a liquid or gas to thesurface of the wafer to be calibrated so as to calibrate the position of the wafer to be calibrated and enable the wafer to be calibrated to keep a vertical state; and the grabbing device is used forgrabbing the wafer to be calibrated to move from one position to another position. The system provided by the invention avoids the problems such as wafer dropping, breaking and scratching due to thechange in position when a transmission gripper grabs the wafer, and improves the yield and output.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a wafer vertical stability calibration system and a method for calibrating the wafer vertical stability. Background technique [0002] Usually, the chemical mechanical polishing (CMP) machine is divided into two parts: grinding part and wafer cleaning. steps, these steps are to take the wafer from one location to another through the gripper claws above the cleaning device. This requires that each position of the wafer be aligned with the position of the gripper to ensure that the gripper can accurately and safely grasp the wafer from one position to another. The position of the grasping is relatively strict. Once the position of each cleaning step deviates, the gripper will fail to grasp the wafer, or scratches and fragments will occur. There are various reasons for the position deviation of each cleaning step. The main reasons are: [0003] 1) The aging or wear of the...

AI Technical Summary

Problems solved by technology

[0003] 1) The aging or wear of the wafer device supporting the acid-base cleaning causes position deviation, and the wafer cannot stand completely vertically in the support device. When the gripper is grasped, the position of the gripper and the position of the wafer cannot be aligned. Cause problems such as falling pieces, fragments, scratches, etc.;

[0004] 2) The cleaning device is composed of many devices during installation, and if the position of the assembly is not balanced, it is likely to cause the wrong position of the gripper to grab. Once the installation is completed, some steps are difficult to adjust, because these positions are all correlational;

[0005] 3) After a long period of use, the gripper for grabbing the wafer is aging

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