Epoxy adhesive for preparing high glass transition temperature cover film and preparation method thereof
A technology of high vitrification and epoxy glue, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of poor heat resistance, unusable, low glass transition temperature of cover film, etc., and achieve simple preparation method , Ease of market promotion, easy access to raw material components
Inactive Publication Date: 2019-02-01
ZHONGSHAN DONGYI HIGH TECH MATERIAL
View PDF9 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0005] In order to solve the problems in the prior art that a large amount of nitrile rubber is added to the epoxy glue, the glass transition temperature of the cover film is low, the heat resistance is poor, and the problem that it cannot be used in a high temperature environment for a long time is one of the purposes of the present invention. Epoxy Adhesive for High Glass Transition Temperature Cover Films
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0031] This example provides four kinds of epoxy adhesives, numbered 1 to 4, as shown in Table 1 and Table 2.
[0032] Two kinds of epoxy glue formulas of 1 and 2 of the embodiment of table 1
[0033]
[0034] Two kinds of epoxy glue formulations of 3 and 4 of the embodiment of table 2
[0035]
[0036]
Embodiment 2
[0038] This example provides the preparation method of epoxy glue, the steps include:
[0039] (1) sanding the filler to 8-12 μm;
[0040] (2) the resin is dissolved in MEK, and the toughening agent, curing agent and curing accelerator are dissolved in DMF;
[0041] (3) After mixing the products obtained in steps (1) and (2), perform PI film coating and stick release paper.
[0042] The mixing speed in step (3) is 150-250 rpm, and the mixing time is 2 hours.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| glass transition temperature | aaaaa | aaaaa |
Login to View More
Abstract
The invention provides an epoxy adhesive for preparing a high glass transition temperature cover film. The raw materials include resin, a toughening agent, a filler, a curing agent, and a curing accelerator, and the resin includes a resin A agent and / or a resin B agent. The epoxy glue is prepared by the following steps: performing sand milling on the filler to 8 to 12 [mu]m, dissolving the resin in MEK, and dissolving the toughening agent, curing agent and curing accelerator in DMF, finally, uniformly mixing the products obtained in the above two steps, performing the PI film coating, and applying a release paper. The epoxy glue provided by the invention increases the glass transition temperature to 210 DEG C, tin immersion is qualified at 300 DEG C for 10 s, and the method solves the problem that the addition of a large amount of nitrile rubber in the conventional epoxy glue causes the cover film to have the low glass transition temperature and poor heat resistance, and cannot be usedin high temperature environments for a long time. The adhesive composition provided by the invention has simple preparation method, easy availability of raw material components, and easy market popularization.
Description
technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to an epoxy adhesive used for preparing a high glass transition temperature covering film and a preparation method thereof. Background technique [0002] Flexible Printed Circuit Board (FPC), also known as flexible printed circuit board, or flexible printed circuit board, refers to the design and production of circuit graphics on flexible substrates by printing. The product. In recent years, the development of the information and communication industry has driven the development of the microelectronics manufacturing industry, and flexible printed circuits have been widely used. Wherein, the covering film is pasted on the flexible circuit after it is formed, so as to protect the circuit. The cover film is used in conjunction with a high-folding-resistant substrate, enabling the entire circuit to be bent at 180 degrees at a speed of 300 revolutions per minute at a temp...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/00
CPCC08L2201/08C08L2205/025C09J11/00C09J163/00C08L63/00C08L79/08
Inventor 徐海斌陈建民
Owner ZHONGSHAN DONGYI HIGH TECH MATERIAL
Features
- R&D
- Intellectual Property
- Life Sciences
- Materials
- Tech Scout
Why Patsnap Eureka
- Unparalleled Data Quality
- Higher Quality Content
- 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com