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End effector and control method for transporting wafer

A technology of end effectors and wafers, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as fragile, difficult operation, and wafer contamination

Active Publication Date: 2021-03-05
华芯(嘉兴)智能装备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the wafer is ground so thin, subsequent processing is more difficult, especially for large silicon wafers larger than 8 inches, which are easily broken and more difficult to operate
[0003] In the prior art, some end effectors adopt a vacuum adsorption method, and the wafer is adsorbed on the end effector before transportation, such as a vacuum suction pen, which consists of a plastic or rubber shell, a vacuum generator (pneumatic type) , vacuum suction cup, elbow and roll tube (pneumatic type). When transferring wafers, the front end of the wafer vacuum suction pen can suck wafers from the wafer cassette. The area is large, it is easy to cause pollution to the wafer, and it is very destructive to large-size wafers and ultra-thin wafers; Case of shedding

Method used

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  • End effector and control method for transporting wafer
  • End effector and control method for transporting wafer
  • End effector and control method for transporting wafer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] The present invention provides an embodiment of an end effector for transporting wafers, such as figure 1 As shown, the end effector includes a substrate 3:

[0062] The first end of the substrate 3 is connected to the mechanical arm, the second end of the substrate 3 away from the first end is provided with an opening, and the concave direction of the opening extends toward the first end of the substrate 3;

[0063] There are several adsorption mechanisms 2 around the opening; Figure 4 As shown, the adsorption mechanism 2 includes at least one groove, the side wall of the groove is provided with at least one air outlet 11; the base plate 3 is also provided with a blower mechanism 5, and the blower mechanism 5 passes through the 10 communicates with the air outlet 11 of the adsorption mechanism 2;

[0064] The gas is sucked in from the blowing mechanism 5, transported to the air outlet 11 through the air passage 10, and blown out from the air outlet 11, generating a ...

Embodiment 2

[0078] The present invention provides an embodiment of an end effector for transporting wafers, such as figure 1 As shown, based on the structure of the end effector in Embodiment 1, a wafer detection device 8 is provided on the substrate 3 of the end effector in this embodiment, and the wafer detection device 8 includes a first wafer detection sensor and a second wafer detection sensor;

[0079] When the end effector is not grabbing a wafer, there is an optical signal propagating between the first wafer detection sensor and the second wafer detection sensor;

[0080] When the end effector grabs the wafer, the wafer blocks the transmission of optical signals between the first wafer detection sensor and the second wafer detection sensor, thereby detecting whether the wafer is detected by the wafer. The grabbing device grabs.

[0081] When the end effector is not grabbing a wafer, there is an optical signal propagating between the first wafer detection sensor and the second wa...

Embodiment 3

[0085] This embodiment provides another embodiment of an end effector, and the end effector includes:

[0086] A substrate 3, the first end of the substrate 3 is connected to the mechanical arm, the second end of the substrate 3 away from the first end is provided with an opening, and the concave direction of the opening is toward the first end of the substrate 3 Extending; the extension end of the opening extending toward the first end of the substrate 3 is arc-shaped;

[0087] Several adsorption mechanisms 2 are arranged around the opening; and the several adsorption mechanisms 2 are evenly arranged along the circumferential direction of the extension end of the opening.

[0088] The adsorption mechanism 2 includes at least one groove, and at least one air outlet 11 is provided on the side wall of the groove; The walls are tangent; the base plate 3 is also provided with a blowing mechanism 5, and the blowing mechanism 5 communicates with the air outlet 11 of the adsorption ...

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PUM

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Abstract

The invention provides an end effector for transporting wafers and a control method thereof. The end effector includes a substrate, the first end of the substrate is connected to a mechanical arm, an opening is provided on the second end of the substrate away from the first end, and the opening is recessed. The direction extends toward the first end of the substrate; several adsorption mechanisms are arranged around the opening; the adsorption mechanism includes at least one groove, and at least one air outlet is arranged on the side wall of the groove; the substrate is also provided with a blowing mechanism, and the blowing mechanism passes the ventilation The duct is connected to the air outlet of the adsorption mechanism; the gas is sucked in from the blower mechanism, blown out from the air outlet through the air duct, and a cyclone is generated in the groove, and the gas cyclone formed in the groove forms a low pressure, and the wafer is adsorbed at the end for execution on the device; the end effector also includes a clamping device for clamping the wafer. When the invention grabs the wafer, the end effector has no contact with the wafer surface, which reduces the pollution and damage to the wafer, and meanwhile, the clamping device can prevent the wafer from falling off when the wafer is transported.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to an end effector for transporting wafers and a control method. Background technique [0002] The IGBT (Insulated Gate Bipolar Transistor) field in the semiconductor industry usually uses ultra-thin wafers. For IGBT devices with specific withstand voltage indicators, the chip thickness needs to be reduced to 100-200 μm, or even 80 μm. When the wafer is ground so thin, subsequent processing is more difficult, especially for large silicon wafers larger than 8 inches, which are easily broken and more difficult to operate. [0003] In the prior art, some end effectors adopt a vacuum adsorption method, and the wafer is adsorbed on the end effector before transportation, such as a vacuum suction pen, which consists of a plastic or rubber shell, a vacuum generator (pneumatic type) , vacuum suction cup, elbow and roll tube (pneumatic type). When transferring wafers, the front en...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683H01L21/67
CPCH01L21/67265H01L21/6838
Inventor 赵宁白富强
Owner 华芯(嘉兴)智能装备有限公司