Mother board of substrate for electronic device
A technology for electronic devices and mother substrates, applied in the direction of electric solid devices, electrical components, semiconductor devices, etc.
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[0030]Embodiments of the present invention will be described below, but the present invention is not limited to the following embodiments.
[0031] FIG. 1 shows a motherboard A of a substrate for an electronic device according to a first embodiment, figure 2 A substrate A' for an electronic device obtained by cutting the mother substrate A is shown. The electronic device substrate A' can be used as a substrate of an organic EL element C described later.
[0032] The mother substrate A includes: a translucent substrate 1 having a first surface 1a and a second surface 1b facing each other in the thickness direction; 2; and a translucent coating layer 3 covering the first surface 1 a of the translucent substrate 1 and the concave-convex layer 2 . The outer peripheral end 3E of the translucent coating layer 3 is located on the inner peripheral side than the outer peripheral end 1E of the translucent substrate 1 over the entire circumference, and the outer peripheral end 2E of t...
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