Flexible panel and manufacturing method thereof
A panel and extension direction technology, applied in the field of flexible panels and its production, can solve the problems of poor joint yield and poor alignment, and achieve the effect of improving yield and reliability and shortening manufacturing time
Active Publication Date: 2019-02-12
AU OPTRONICS CORP
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Problems solved by technology
Generally speaking, the substrate used in the flexible panel is a flexible substrate. However, in the process of manufacturing the flexible panel, after the flexible substrate is separated from the carrier, the stress caused by the The distance between the pads on the permanent substrate changes too much, so that in the subsequent packaging, problems such as poor alignment and poor bonding yield will occur during the bonding process between the chip and the pads.
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[0067] The present invention will be described more fully below with reference to the drawings of this embodiment. However, the present invention can also be embodied in various forms and should not be limited to the embodiments described herein. The thicknesses of layers and regions in the drawings may be exaggerated for clarity. The same or similar reference numerals denote the same or similar elements, and the following paragraphs will not repeat them one by one. In addition, the directional terms mentioned in the embodiments, such as: up, down, left, right, front or back, etc., are only directions referring to the attached drawings. Accordingly, the directional terms are used to illustrate and not to limit the invention.
[0068] Figure 1A It is a schematic top view of the flexible panel according to the first embodiment of the present invention. Figure 1B It is a schematic cross-sectional view of the flexible panel according to the first embodiment of the present inv...
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The invention provides a flexible panel and a manufacturing method thereof. The flexible panel includes a flexible substrate, a first insulating layer, a first interlayer insulating layer, a second interlayer insulating layer, an array of elements, a plurality of pads, and a plurality of buffer patterns. The first insulating layer is disposed on the flexible substrate. The first interlayer insulating layer and the second interlayer insulating layer are disposed on the first insulating layer. The element array is disposed on a flexible substrate. A plurality of pads are electrically connected to the array of elements. The plurality of buffer patterns are not in contact with the plurality of pads and include a first pattern and a second pattern on the flexible substrate. The extending direction of the first pattern forms an included angle of more than 0 degrees and less than 180 degrees with the extending direction of the second pattern.
Description
technical field [0001] The present invention relates to a semiconductor and its manufacturing method, and in particular to a flexible panel and its manufacturing method. Background technique [0002] With the widespread application of portable panels, the development of flexible panels is becoming more and more active, so as to achieve the purpose of displaying under different curved surfaces. Generally speaking, the substrate used in the flexible panel is a flexible substrate. However, in the process of manufacturing the flexible panel, after the flexible substrate is separated from the carrier, the stress caused by the The distance between the pads on the permanent substrate varies too much, so that in the subsequent packaging, problems such as poor alignment and poor bonding yield will occur during the bonding process between the chip and the pads. [0003] Therefore, how to solve the above problems has become an urgent problem to be solved at present. Contents of the ...
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IPC IPC(8): H01L23/00H01L27/32
CPCH01L23/562H10K59/88H10K59/12H10K59/1201
Inventor 刘京桦柯聪盈黄士轩林明纬
Owner AU OPTRONICS CORP