Semiconductor device and manufacturing method thereof

Abstract

A semiconductor device includes: at least one conductive feature disposed on a substrate; at least one dielectric layer covering the substrate, a trench structure extending through the at least one dielectric layer; and a protective layer covering the trench structure.

Description

technical field [0001] The present disclosure relates to a semiconductor device and a manufacturing method thereof. Background technique [0002] The semiconductor industry has continued to pursue higher device densities and lower costs. Technological advances in semiconductor devices or integrated circuits (ICs), materials, design and manufacturing processes have produced increasingly smaller circuits. In the course of this IC evolution, functional density (eg, the number of interconnected devices per die area) has typically increased while geometries have decreased. This downscaling process typically provides benefits by increasing production efficiency and reducing associated costs. [0003] However, increasing functional density has increased the complexity of ICs, for example by reducing the distance between interconnect devices and the number of dielectric layers per die area. Thus, there may be a greater chance of failure per wafer area during semiconductor process...

AI Technical Summary

Problems solved by technology

[0004] Therefore, traditional semiconductor device manufacturing and processing technologies are not fully satisfactory

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