Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Moving arm, chemical mechanical grinding trimmer and grinding equipment

A technology of arms and shells, which is applied in the field of semiconductor manufacturing, can solve problems such as droplet drop and achieve the effect of preventing contamination

Inactive Publication Date: 2019-02-15
YANGTZE MEMORY TECH CO LTD
View PDF11 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, there is a possibility that liquid drops may fall on the polishing pad when the existing polishing pad dresser trims the polishing pad.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Moving arm, chemical mechanical grinding trimmer and grinding equipment
  • Moving arm, chemical mechanical grinding trimmer and grinding equipment
  • Moving arm, chemical mechanical grinding trimmer and grinding equipment

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0030] refer to figure 1 , the mobile arm 21 includes: an arm body, a shell 200 covering the arm body, and a liquid storage device 202 located on the surface of the shell 200, the liquid storage device 202 is used to store the liquid droplets accumulated on the shell, and the stored The droplets drain into downcomer 209 .

[0031] The arm body of the moving arm 21 includes a support component, transmission components, drive components, liquid pipelines and / or related circuits installed on the support component, so that the arm has functions such as moving, holding or absorbing. The movement includes horizontal movement, vertical movement, rotation, or stretching, and the holding or absorbing includes holding or absorbing the trimming disk and the liquid ejection head.

[0032] In one embodiment, the transmission component comprises a shaft transmission, a gear transmission or a belt transmission. The driving device includes a motor driving device or an air cylinder driving d...

no. 2 example

[0045] refer to figure 2 The difference between this embodiment and the previous embodiments is that the bottom plate 201a in this embodiment has an inclined surface, and the inclined surface is inclined toward the direction of the liquid discharge part 206, so that the liquid flowing from the cover plate 203 on the bottom plate 201a The liquid droplets can easily flow to the direction of the drain pipe 210 , and are conveniently discharged from the liquid discharge pipe 210 , so that the liquid droplets will not be left on the bottom plate 201 a and keep the bottom plate 201 a dry.

[0046] In one embodiment, the inclination angle of the surface of the bottom plate 201a is 30-80°.

[0047] It should be noted that, the definition or description of the same or similar structure in this embodiment as in the previous embodiment will not be repeated in this embodiment, and please refer to the definition or description of the corresponding part in the previous embodiment for detai...

no. 3 example

[0049] refer to image 3 , the present invention also provides a chemical mechanical abrasive dresser, including the moving arm 21 described in the foregoing embodiments; the head of the moving arm 21 is equipped with a dressing disc 31 .

[0050] In this embodiment, the moving arm 21 can perform one or more actions of vertical movement, horizontal movement and rotation. Both the vertical movement and the horizontal movement are linear movements.

[0051] The conditioning disc 31 is rotatable.

[0052] When the dresser of the embodiment of the present invention is used for dressing, the liquid droplets on the arm can be prevented from dripping onto the grinding pad to be dressed below.

[0053] It should be noted that, the definition or description of the same or similar structures in this embodiment and the foregoing embodiments will not be repeated in this embodiment. For details, please refer to the definitions or descriptions of corresponding parts in the foregoing embod...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Disclosed are a moving arm, a chemical mechanical grinding trimmer and grinding equipment. The moving arm comprises a shell wrapping an arm body, and a liquid storage device located on the surface ofthe shell. The liquid storage device is used for storing liquid drops accumulating on the shell and for discharging the stored liquid drops into a lower discharge pipe. According to the moving arm, the liquid drops on the arm can be prevented from dropping onto a lower grinding pad.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a mobile arm, a chemical mechanical grinding trimmer and grinding equipment. Background technique [0002] In the semiconductor manufacturing process, chemical mechanical polishing (CMP) is a very important process, sometimes also called chemical mechanical polishing or planarization. The so-called chemical mechanical polishing is a process that uses chemical and mechanical combined action to remove excess material from semiconductor silicon wafers and obtain a flat surface. [0003] Chemical mechanical grinding is carried out by chemical mechanical grinding equipment, and existing chemical mechanical grinding equipment generally includes: grinding table, grinding pad, grinding fluid supply end, grinding pad dresser and grinding head, wherein grinding pad is arranged on the grinding table; grinding The head is used to fix the wafer to be ground, so that the wafer to be...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/00B24B37/34B24B57/00
CPCB24B37/00B24B37/34B24B57/00
Inventor 高林
Owner YANGTZE MEMORY TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products