A kind of anti-potential induced decay multilayer composite photovoltaic encapsulation film and preparation method and application

Abstract

The invention discloses a multi-layer composite photovoltaic encapsulation adhesive film resistant to potential-induced attenuation, a preparation method and an application thereof. The laminated photovoltaic encapsulation adhesive film has 2 to 5 layers in total, wherein the barrier layer has 1 to 3 layers. In the invention, a barrier layer is provided in the multi-layer composite encapsulation adhesive film, and the formulation optimization design of the barrier layer can improve the anti-potential-induced attenuation performance of the photovoltaic encapsulation adhesive film. By adding a charge dissipator to the barrier layer, it absorbs and eliminates the charge enriched on the surface of the cell, quenches the charge, and enhances the anti-potential-induced attenuation performance of the adhesive film; the matrix material of the barrier layer has a higher volume resistivity, and a lower High water vapor transmission rate, to achieve the purpose of water and oxygen resistance.

Description

Technical field [0001] The present invention belongs to the field of the photovoltaic module, which specifically relates to a multilayer composite photovoltaic encapsulating film of PotentialInduced Decradation (PID) and the preparation method thereof, mainly applied to the package of photovoltaic assembly. Background technique [0002] The crystal silicon solar cell assembly has long been a serious challenge, that is, potential induction attenuation (PID) effect. Potential induction attenuation phenomenon is that the assembly has a long-term leakage current between the glass, package material, the battery, and the border, resulting in a large number of charges to be gathered in the surface of the battery, making the surface passivation effect of the battery sheets, and finally Resulting in ff, ISC, VOC reduced, severely caused by more than 50%, resulting in serious decline in power generation, affecting the income of the entire photovoltaic power station. [0003] Under the driv...

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Problems solved by technology

Patent CN105950039 A discloses an anti-PID polyolefin adhesive film for solar modules, using polyolefin POE instead of EVA as packaging material to increase the volume resistivity of the adhesive film, but the raw material price of polyolefin resin is relatively high, which increases the The packaging cost of components, and the POE material has a large cohesive energy and poor adhesion to glass. Long-term outdoor use is prone to delamination of the adhesive film and glass

Patent CN103421443 B provides a kind of encapsulant film for solar cell module, and described encapsulant film comprises polyolefin barrier layer and is positioned at the first adhesive layer and the second adhesive layer (siloxane graft polymer Composition with ethylene-alpha olefin or composition of siloxane graft polymer and EVA), the encapsulation adhesive film can solve the adhesive force between the adhesive film and glass and battery sheet due to the introduction of siloxane graft copolymer Poor problem, but the encapsulation film can only be used for the anti-PID of conventional cell components, and the anti-PID effect of double-sided cell components is not ideal

In terms of packaging material production process: Dupont, USA TM The PID protective film of DuPont ionomer is proposed. The PID protective film is prepared based on the ionomeric polymer technology verified by more than 15 years of crystal silicon module experiments. The thickness is about 50 μm, and it is placed between the photovoltaic glass and the EVA encapsulation film. It can effectively block the migration of sodium ions to the surface of the cell and completely solve the PID problem, but the material is relatively expensive, which limits its promotion and application in the market

In terms of cell production technology, CN104576826 B discloses a cell post-treatment method, which prepares a non-stick coating on the surface of the aluminum back field to improve the compactness of the silicon nitride film, and a subsequent high-temperature annealing process to improve the anti-PID ability of the cell , but this method increases the production cost of cells, which is not conducive to the cost reduction of photovoltaic modules

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